F3L150R07W2E3_B11

Abbildungen dienen nur als Referenz

F3L150R07W2E3_B11

+Stückliste

  • HerstellerInfineon-Technologien

  • Herstellerteil #F3L150R07W2E3_B11

  • Auf Lager3867

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Package / Case Module
Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 150 C
Brand Infineon Technologies
Product Type IGBT Modules
Subcategory IGBTs
Series Trenchstop IGBT3
Mounting Type SMD/SMT
Factory Pack Quantity 15
Technology Si
Product IGBT Modules
Configuration 3-Phase Inverter
Collector - Emitter Voltage VCEO Max 650 V
Collector - Emitter Saturation Voltage 1.45 V
Continuous Collector Current at 25 C 150 A
Gate - Emitter Leakage Current 400 nA
Pd - Power Dissipation 335 W
Maximum Gate Emitter Voltage 20 V
Part # Aliases SP000638568 F3L150R07W2E3B11BOMA1
Packaging Tray
Tradename EasyPACK
Unit Weight 1.375685 oz
REACH - SVHC Details

Übersicht

Description

The F3L150R07W2E3_B11 is a specific model of power semiconductor device, typically a field-effect transistor (FET) or insulated gate bipolar transistor (IGBT) used in various electronic applications. The "F3" often denotes the series or family, while "L150" indicates the maximum current rating (150A). The "R07" refers to the on-state resistance (0.07 ohms), which is a crucial parameter for efficiency in switching applications. The "W2" may denote the package type or mounting style, and "E3" can indicate the environmental rating or specific features like certification. Lastly, "B11" might refer to a specific variant or version within the model line.
These devices are commonly utilized in power conversion, motor control, and renewable energy applications due to their efficiency and reliability. Understanding the specifications of F3L150R07W2E3_B11 helps engineers select appropriate components for their designs, ensuring optimal performance and durability in electronic systems.

Equivalent

The F3L150R07W2E3_B11 is an IGBT (Insulated Gate Bipolar Transistor) module. Equivalent products include the F3L150R07W2E3, F3L150R07W2E4, and similar IGBT modules from manufacturers like Infineon, Mitsubishi, and ON Semiconductor, focusing on comparable voltage ratings, current capabilities, and switching characteristics. Always verify specific application requirements and datasheets for exact compatibility.

Features

The F3L150R07W2E3_B11 is a power semiconductor device, specifically a silicon carbide (SiC) MOSFET, designed for high-efficiency applications. Key features include:
1. Voltage Rating: Operates at a maximum of 1500V, suitable for high-voltage applications.
2. Current Rating: Handles continuous current up to 150A, enabling it to drive substantial loads.
3. Low RDS(on): Offers low on-resistance, which minimizes conduction losses and improves efficiency.
4. Fast Switching: Designed for high-speed switching, helping to achieve better thermal management and reduced switching losses.
5. High Thermal Conductivity: Excellent thermal performance due to SiC material properties, enhancing reliability and performance in demanding environments.
6. Robustness: Features rugged construction suitable for harsh conditions and heavy-duty applications.
7. Package Type: Often available in a TO-247 or similar package, facilitating easy integration into various circuits.
These characteristics make the F3L150R07W2E3_B11 ideal for applications in renewable energy, industrial drives, and electric vehicles.

Pinout

The F3L150R07W2E3_B11 is an IGBT (Insulated Gate Bipolar Transistor) module produced by Infineon Technologies. It typically features a pin count of 7, which includes connections for the collector, emitter, gate, and various other inputs or outputs related to its operation.
The primary functions of the F3L150R07W2E3_B11 include:
1. Switching: It serves as a high-power switch in inverter applications, facilitating efficient power conversion.
2. Control: The gate pin allows for control of the switching operation, enabling it to turn on and off effectively.
3. Thermal Management: Features are integrated to handle heat dissipation due to high current operations.
This component is widely used in industrial applications, such as motor drives and renewable energy systems, owing to its efficiency and robustness. Always refer to the specific datasheet for detailed pin configuration and electrical characteristics.

Manufacturer

The manufacturer of the F3L150R07W2E3_B11 is Infineon Technologies AG. Infineon is a global semiconductor manufacturer headquartered in Neubiberg, Germany. The company specializes in developing and producing a wide range of semiconductor solutions for various applications, including automotive, industrial, and security sectors. Infineon's products include power semiconductors, microcontrollers, sensors, and other advanced technologies that enable energy efficiency, connectivity, and safety in electronic systems.
Infineon operates in markets such as automotive electronics, industrial power control, power management, and security solutions, positioning itself as a leading player in the semiconductor industry. The company is committed to innovation and sustainability, focusing on delivering high-performance solutions that meet the growing demands for smart and energy-efficient technologies.

Application

The F3L150R07W2E3_B11 is a power semiconductor device, specifically an IGBT (Insulated Gate Bipolar Transistor). Its primary application areas include:
1. Industrial Drives: Used in motor control for various industrial applications.
2. Renewable Energy: Employed in solar inverters and wind turbine converters.
3. Rail Transportation: Utilized in traction drives for trains and trams.
4. HVAC Systems: Integrated into variable frequency drives for energy-efficient heating and cooling.
5. Power Supply Systems: Incorporated into switch-mode power supplies for efficient energy conversion.
These applications leverage its high efficiency and fast switching capabilities for improved performance and energy savings.

Package

The F3L150R07W2E3_B11 is packaged in a TO-247 form factor, which is commonly used for power semiconductor devices. This package type allows for efficient heat dissipation and is suitable for various applications in power electronics.

Produkte, die mit F3L150R07W2E3_B11 zusammenhängen