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FDMF3170
+StücklisteLOW VOLTAGE SMART POWER STAGE 3
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HerstellerOnsemi
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Herstellerteil #FDMF3170
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Paket PQFN-39
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Auf Lager4785
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tape & Reel (TR),Cut Tape (CT) |
| Part Status | Active |
| Output Configuration | Half Bridge (2) |
| Applications | General Purpose |
| Interface | Logic, PWM |
| Load Type | Inductive |
| Technology | Power MOSFET |
| Current - Output / Channel | 55A |
| Current - Peak Output | 70A |
| Voltage - Supply | 4.5V ~ 5.5V |
| Voltage - Load | 4.5V ~ 16V |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Fault Protection | Current Limiting, Over Temperature, UVLO |
| Mounting Type | Surface Mount |
Übersicht
Description
Equivalent
1. Infineon's IR3553
2. Texas Instruments' CSD97370Q4M
3. Vishay's SiC620
4. ON Semiconductor's FDMF6823C
These are comparable in function but specifications like current ratings or voltage limits may vary, so always check datasheets for compatibility.
Features
1. Integrated Drivers and MOSFETs: Combines high-speed drivers and highly efficient MOSFETs, optimizing performance in compact designs.
2. High Efficiency: Designed for high-efficiency operation, minimizing power losses and improving thermal management.
3. Low RDS(on): Features low on-state resistance (RDS(on)) for both the high-side and low-side MOSFETs, which reduces conduction losses.
4. High Switching Frequency: Capable of operating at high switching frequencies, which aids in reducing the size of external components such as inductors and capacitors.
5. Integrated Bootstrap Diode: Simplifies the PCB layout by eliminating the need for an external bootstrap diode.
6. Protection Features: Includes various protection mechanisms such as over-temperature protection, under-voltage lockout, and over-current protection to enhance reliability.
7. Compact Package: Comes in a small package, which is ideal for space-constrained applications.
These features make the FDMF3170 suitable for use in computing, telecommunications, and other electronics that require efficient power delivery solutions.
Pinout
Key functions of the FDMF3170 include:
1. Switching Control: It controls the high-side and low-side MOSFETs to efficiently convert voltage levels in applications like DC-DC converters.
2. Integrated Driver: The driver IC enables efficient switching of the power MOSFETs, reducing the need for external components.
3. Protection Features: The module includes over-temperature protection, under-voltage lockout, and shoot-through protection for reliable operation.
4. Thermal Management: Its design allows for effective heat dissipation, improving performance and reliability.
This integration reduces design complexity and helps in achieving higher power density in power management applications.