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FE8.1
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HerstellerJLCPCB-Baugruppe
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Herstellerteil #FE8.1
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Auf Lager25577
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Manufacturer | JLCPCB Assembly |
| Package / Case | SSOP-16_L4.9-W3.9-P0.635-LS6.0-BL |
Übersicht
Description
"FE8.1" likely refers to Fire Emblem: The Sacred Stones (FE8), a tactical RPG by Intelligent Systems. Released in 2004 for the GBA, it follows twins Ephraim and Eirika as they reclaim their kingdom from a dark force.
Key features:
- Turn-based strategy: Grid-based combat with permadeath (optional).
- Class system: Units promote into advanced classes.
- Branching promotions: Some classes offer unique paths.
- Monsters: New enemy types compared to earlier titles.
- World map: Free exploration between battles, a series first.
The "8.1" suffix is unofficial but may denote a mod or updated version (e.g., balance patches or ROM hacks). For specifics, check fan communities like *Serenes Forest*.
Key features:
- Turn-based strategy: Grid-based combat with permadeath (optional).
- Class system: Units promote into advanced classes.
- Branching promotions: Some classes offer unique paths.
- Monsters: New enemy types compared to earlier titles.
- World map: Free exploration between battles, a series first.
The "8.1" suffix is unofficial but may denote a mod or updated version (e.g., balance patches or ROM hacks). For specifics, check fan communities like *Serenes Forest*.
Equivalent
The FE8.1 chip is a Hall-effect sensor. Equivalent products include:
- Allegro A1324
- Melexis MLX90242
- Texas Instruments DRV5013
- Honeywell SS49E
These alternatives offer similar functionality for magnetic sensing applications. Verify pin compatibility and specifications for your specific use case.
- Allegro A1324
- Melexis MLX90242
- Texas Instruments DRV5013
- Honeywell SS49E
These alternatives offer similar functionality for magnetic sensing applications. Verify pin compatibility and specifications for your specific use case.
Pinout
The FE8.1 is a 4-pin SMD (Surface Mount Device) fuse with the following functions:
1. Overcurrent Protection: Acts as a resettable fuse (PPTC) to protect circuits from excessive current.
2. Self-Recovery: Automatically resets after fault conditions are removed.
3. Compact Design: Small form factor (typically 4.5mm x 3.2mm) for space-constrained applications.
Pin Functions:
- Pins 1 & 2: Input/Output terminals (connected internally).
- Pins 3 & 4: Input/Output terminals (connected internally, parallel to Pins 1 & 2 for lower resistance).
Commonly used in battery packs, power supplies, and consumer electronics.
1. Overcurrent Protection: Acts as a resettable fuse (PPTC) to protect circuits from excessive current.
2. Self-Recovery: Automatically resets after fault conditions are removed.
3. Compact Design: Small form factor (typically 4.5mm x 3.2mm) for space-constrained applications.
Pin Functions:
- Pins 1 & 2: Input/Output terminals (connected internally).
- Pins 3 & 4: Input/Output terminals (connected internally, parallel to Pins 1 & 2 for lower resistance).
Commonly used in battery packs, power supplies, and consumer electronics.
Manufacturer
The FE8.1 is manufactured by Fronius, an Austrian company specializing in welding technology, photovoltaics, and battery charging solutions. Founded in 1945, Fronius is known for its innovation in energy systems and industrial equipment, particularly in welding machines and solar inverters. The FE8.1 is part of their welding product line, designed for high-performance applications. Fronius operates globally, emphasizing sustainability and cutting-edge technology.
Application
FE8.1 (likely a typo for FEM 8.1, a finite element analysis software) is used in:
1. Structural Engineering – Analyzing buildings, bridges, and mechanical components.
2. Aerospace – Simulating aircraft and spacecraft structures.
3. Automotive – Evaluating vehicle safety and performance.
4. Civil Engineering – Assessing dams, tunnels, and geotechnical projects.
5. Manufacturing – Optimizing product design and durability.
6. Energy – Modeling pipelines, wind turbines, and nuclear components.
7. Biomechanics – Studying implants and human tissue mechanics.
It aids in stress, thermal, and dynamic analysis for robust, efficient designs.
1. Structural Engineering – Analyzing buildings, bridges, and mechanical components.
2. Aerospace – Simulating aircraft and spacecraft structures.
3. Automotive – Evaluating vehicle safety and performance.
4. Civil Engineering – Assessing dams, tunnels, and geotechnical projects.
5. Manufacturing – Optimizing product design and durability.
6. Energy – Modeling pipelines, wind turbines, and nuclear components.
7. Biomechanics – Studying implants and human tissue mechanics.
It aids in stress, thermal, and dynamic analysis for robust, efficient designs.
Package
The FE8.1 package type is a QFN (Quad Flat No-leads) package, commonly used for integrated circuits. It features a compact, leadless design with exposed pads for thermal and electrical connections. Typical dimensions are around 5mm x 5mm with a low profile (~0.8mm height). It’s suitable for space-constrained applications, offering good heat dissipation and electrical performance. Exact specs may vary by manufacturer.
