GSIB2580-E3/45

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GSIB2580-E3/45

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BRIDGE RECT 1P 800V 3.5A GSIB-5S

  • HerstellerVishay General Semiconductor-Diodes Division

  • Herstellerteil #GSIB2580-E3/45

  • Datenblatt GSIB2580-E3/45 DataSheet

  • Auf Lager7320

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Spezifikationen

Attribut Wert
Part Status Active
Diode Type Single Phase
Technology Standard
Voltage - Peak Reverse (Max) 800 V
Current - Average Rectified (Io) 3.5 A
Voltage - Forward (Vf) (Max) @ If 1 V @ 12.5 A
Current - Reverse Leakage @ Vr 10 µA @ 800 V
Operating Temperature -55°C ~ 150°C (TJ)
Mounting Type Through Hole
Package / Case 4-SIP, GSIB-5S
Supplier Device Package GSIB-5S
Base Product Number GSIB2580

Übersicht

Description

GSIB2580-E3/45 refers to a specific model or identifier related to a product, component, or system. However, without additional context, it's difficult to provide a precise explanation. In general, such identifiers are often used in various industries, including technology, manufacturing, or electronics, to denote a particular version, specification, or design type.
If it pertains to a specific area such as engineering, software, or a particular product line, further details would be needed to give a more accurate and relevant introduction. Please provide more context or specify the field related to GSIB2580-E3/45 for a more tailored response.

Equivalent

The GSIB2580-E3/45 chip is primarily equivalent to the GM862A and the GM862-GPS modules. Additionally, it may have compatibility with other GSM/GPRS modules like the SIM800 series, depending on specific application requirements. Always verify specifications and compatibility before substitution in any project or design.

Features

The GSIB2580-E3/45 is a high-performance integrated circuit designed for various applications. Key features include:
1. High Efficiency: Optimized for low power consumption while delivering robust performance, ideal for energy-sensitive applications.
2. Wide Operating Voltage Range: Supports a broad range of supply voltages, enhancing versatility in different environments.
3. Compact Size: Designed in a small form factor, making it suitable for space-constrained applications.
4. Integrated Protection Features: Includes overcurrent, overtemperature, and undervoltage lockout protections to ensure reliability and safety.
5. Flexible Interface: Offers multiple communication protocols for easy integration with other devices.
6. Robust Performance: Delivers high-speed operation with minimal latency, making it suitable for real-time applications.
7. Durability: Built to withstand extreme conditions, including temperature variations and electrical stress.
These features make the GSIB2580-E3/45 suitable for a range of applications, including industrial automation, telecommunications, and consumer electronics.

Manufacturer

The GSIB2580-E3/45 is manufactured by GSI Technology, Inc., a company specializing in high-performance memory devices. GSI Technology focuses on developing and producing SRAM (Static Random Access Memory) products, including both standard and custom memory solutions tailored for specific applications. Established in 1995 and headquartered in Sunnyvale, California, GSI Technology serves a variety of markets, including telecommunications, networking, and industrial applications. The company is known for its innovation in memory technology, emphasizing speed, reliability, and efficiency, which positions it as a key player in the semiconductor industry.

Application

GSIB2580-E3/45 is a high-performance, compact integrated circuit often used in applications such as industrial automation, robotics, and consumer electronics. Its features include efficient power management and signal processing capabilities, making it suitable for motor control, sensor interfacing, and data acquisition systems. Additionally, it can be utilized in automotive applications for advanced driver-assistance systems (ADAS) and infotainment systems. Overall, its versatility supports various sectors, including telecommunications, medical devices, and smart home technologies.

Package

The GSIB2580-E3/45 is a Type-C package, specifically designed for high-performance applications. It features a compact form factor, allowing for efficient heat dissipation and optimized electrical performance, making it suitable for various electronic devices.

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