HMC554

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HMC554

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IC MMIC MIXER DBL-BAL DIE

  • HerstellerAnalog Devices Inc.

  • Herstellerteil #HMC554

  • Paket Die

  • Auf Lager2363

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Supplier Analog Devices Inc.
Package Bulk
ProductStatus Obsolete
RFType VSAT
Frequency 11GHz ~ 20GHz
NumberofMixers 1
NoiseFigure 8dB
SecondaryAttributes Up/Down Converter
MountingType Surface Mount
Package/Case Die

Übersicht

Description

HMC554 is a GaAs MMIC mixer from Hittite (now Analog Devices) used for RF/microwave frequency conversion.
- Type: double-balanced mixer with RF, LO, and IF ports; suitable for up/down-conversion in microwave front-ends.
- Characteristics: broadband operation across a wide frequency range; typically requires external matching networks (some variants include integrated matching); good port isolation in a compact MMIC package.
- Variants: multiple versions (e.g., HMC554 family) with different frequency bands and packaging; check the exact datasheet for RF/LO/IF ranges and LO drive requirements.
- How to use: select the appropriate variant, design RF/IF and LO matching networks, provide a stable LO source and proper biasing, and account for conversion loss, isolation, and IP3 in your design.
- Typical applications: receivers, transceivers, up/down-conversion stages, test equipment and other microwave front-ends.
If you need specifics, tell me the exact variant or your target frequency band and I’ll summarize the datasheet.

Pinout

Pin count: 8 pins.
Function: HMC554 is a GaAs MMIC mixer (Gilbert-cell) used for RF downconversion, with an RF input, LO input, and IF output (plus grounds/power as per the 8-pin package).

Manufacturer

Manufacturer: Hittite Microwave Corporation (now part of Analog Devices).
What kind of company: A fabless semiconductor company that designs and sells RF/microwave integrated circuits (GaAs MMICs and other RFICs).

Application

HMC554 is a microwave MMIC device used in RF front‑end modules. Common application areas include:
- Wireless infrastructure (base stations, microwave backhaul, point‑to‑point links)
- Radar, defense, and surveillance systems
- Satellite communications and VSAT terminals
- Aerospace/military RF subsystems
- Test, measurement, and benchtop instrumentation
Typical roles: front‑end components such as mixers, amplifiers, attenuators, switches, or frequency converters within integrated transceiver blocks.

Package

HMC554 is packaged in an 8-lead surface-mount MSOP plastic package (MSOP-8). It is RoHS-compliant and designed for SMT assembly.

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