IDT72P51359L5BB8

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IDT72P51359L5BB8

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IC MULTI-QUEUE FLOW-CTRL 256BGA

  • HerstellerRenesas Electronics America Inc.

  • Herstellerteil #IDT72P51359L5BB8

  • Paket BBGA-256

  • Auf Lager8460

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Package / Case Tape & Reel (TR)
Part Status Obsolete
Type Multi-Queue Flow-Control
Mounting Type Surface Mount

Übersicht

Description

The IDT72P51359L5BB8 is a FIFO (First-In, First-Out) memory device produced by Integrated Device Technology (IDT), now part of Renesas Electronics. This component is designed to buffer data in communication systems and ensure smooth data flow between devices or processes that operate at different speeds. It features a high-density, high-speed architecture that is suitable for networking, telecommunication, and data processing applications.
Key features of the IDT72P51359L5BB8 include high clock speeds for rapid data transfer, large storage capacity to accommodate significant data loads, and low power consumption to enhance efficiency and reduce thermal output. It supports a wide range of operating voltages, increasing its versatility across different systems.
The device utilizes advanced design techniques to offer reliable data integrity and minimal propagation delays. Its robust architecture ensures data is managed efficiently, with capabilities for error detection and correction. This makes it ideal for use in high-performance systems where data throughput and reliability are critical considerations.

Equivalent

The IDT72P51359L5BB8 is a FIFO (First In, First Out) memory chip. Equivalent products would typically be FIFO chips with similar specifications such as depth, width, and speed. Manufacturers like Texas Instruments, Cypress (Infineon), and Renesas may offer comparable solutions. For specific equivalents, you should check component databases or distributors like Mouser, Digi-Key, or Arrow for FIFO chips matching the IDT72P51359L5BB8's specifications. Always ensure equivalency in terms of pin configuration, voltage, and performance requirements.

Features

The IDT72P51359L5BB8 is a FIFO (First-In, First-Out) memory chip, typically used for buffering and managing data flow between devices with different data processing rates. Here are its key features:
1. FIFO Capacity: It typically offers a depth of 72K x 36 bits, providing substantial storage for data buffering.
2. Speed: Designed for high-speed data transfer, supporting various data communication applications.
3. Data Width: The 36-bit wide data path facilitates handling larger chunks of data per cycle, which is beneficial for applications requiring high throughput.
4. Dual-Port Memory: Allows simultaneous read and write operations from different ports, enabling efficient data handling.
5. Flexible Configuration: It offers programmable flags and status indicators to manage data flow and prevent overflow or underflow conditions.
6. Compatibility: Suitable for applications requiring high-speed data transfer, such as networking, telecommunications, and data processing systems.
7. Voltage and Power: It typically operates at standard voltage levels compatible with most digital systems, ensuring ease of integration.
8. Package Type: Generally available in a package type conducive to efficient thermal management and space-saving on PCBs.
These features make it ideal for applications needing efficient management of data streams between asynchronous systems.

Pinout

The IDT72P51359L5BB8 is a FIFO (First-In, First-Out) memory device. It is part of the IDT FIFO product family specifically designed for high-speed data buffering and data rate matching applications.
The specific pin count for the IDT72P51359L5BB8 is 144 pins. These pins are arranged in a Ball Grid Array (BGA) package.
In terms of functionality, this device is used for temporary data storage and is capable of managing synchronous or asynchronous data flow between systems operating at different speeds. The FIFO feature allows seamless and efficient data transfer with minimal latency. Common functions associated with the IDT72P51359 include read/write operations, input and output data port management, and status flag signaling to indicate full, empty, or half-full conditions. This makes it suitable for applications that require high-throughput data processing, such as networking, telecommunications, and multimedia systems.
Please refer to the official datasheet for detailed specifications and additional functional capabilities.

Manufacturer

The IDT72P51359L5BB8 is manufactured by Integrated Device Technology, Inc. (IDT). IDT is a company that specializes in designing and manufacturing a broad range of semiconductor solutions. These solutions cater to applications in a variety of fields, including communications, computing, consumer, automotive, and industrial markets. Their product offerings often include memory and logic devices, interface solutions, wireless power, and timing products. In 2019, IDT was acquired by Renesas Electronics Corporation, a Japanese semiconductor manufacturer, expanding their portfolio to include IDT's products and technologies. Overall, IDT, as part of Renesas, focuses on providing advanced and integrated semiconductor solutions to enhance performance and efficiency in electronic systems.

Application

The IDT72P51359L5BB8 is a FIFO (First-In-First-Out) memory device, commonly used in applications requiring buffering and data rate matching. These applications include telecommunications systems, data storage systems, and network equipment, where it helps manage data flow between components operating at different speeds. Additionally, it can be used in digital signal processing, video processing, and any system that requires temporary storage to handle data burstiness or to align timing between different subsystems. The FIFO structure ensures efficient and orderly data processing, making it ideal for high-speed data applications.

Package

The IDT72P51359L5BB8 is typically packaged in a Ball Grid Array (BGA) format, which is known for its high-density connection capability suitable for integrated circuits. Please verify with the manufacturer's specifications for the most accurate information.

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