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IC DRAM 4GBIT PARALLEL 96TWBGA
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HerstellerISSI, Integrated Silicon Solution Inc.
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Herstellerteil #IS46TR16256AL-125KBLA2
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Datenblatt IS46TR16256AL-125KBLA2 DataSheet
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Auf Lager7173
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Part Status | Obsolete |
| Digi Key Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR3L |
| Memory Size | 4Gbit |
| Memory Organization | 256M x 16 |
| Memory Interface | Parallel |
| Write Cycle Time - Word, Page | 15ns |
| Voltage - Supply | 1.283V ~ 1.45V |
| Operating Temperature | -40°C ~ 105°C (TC) |
| Mounting Type | Surface Mount |
| Package / Case | 96-TFBGA |
| Supplier Device Package | 96-TWBGA (9x13) |
| Base Product Number | IS46TR16256 |
| Clock Frequency | 800 MHz |
| Access Time | 20 ns |
Übersicht
Description
The module adheres to JEDEC standards, ensuring compatibility with various systems. It includes features such as a low voltage operation (1.5V), which contributes to energy efficiency. Additionally, the memory chip offers advanced functionalities like an on-die termination and a burst length of 8, optimizing both data transfer rates and signal integrity.
Typically used in laptops, desktops, and servers, this DRAM is essential for applications demanding high bandwidth, such as gaming, graphic design, and data-intensive computing. Overall, the IS46TR16256AL-125KBLA2 is a reliable choice for enhancing system memory performance in modern electronics.
Equivalent
1. MT41J256M8 (Micron)
2. H5TQ2G83EFR (Hynix)
3. K3AAG2G40B (Samsung)
4. IDT72V361L15 (Integrated Device Technology)
Always verify compatibility regarding voltage, speed, and timing parameters before substituting.
Features
1. Density: 2 Gigabit capacity, organized as 256Mx16 bits.
2. Speed: Operates at a clock frequency up to 125 MHz, with data transfer rates of up to 1.6 Gbps.
3. Voltage: Low operating voltage of 1.5V, enhancing power efficiency.
4. Package: Available in a compact 78-ball FBGA (Fine Ball Grid Array) package for space-constrained designs.
5. Latency: Supports various CAS latency options for optimized performance.
6. Architecture: Supports burst read/write operations, enhancing throughput.
7. Temperature Range: Suitable for industrial applications with a wide operating temperature range.
This chip is ideal for applications requiring reliable and high-speed memory performance.
Pinout
The primary functions of the chip include data storage and retrieval, supporting various DDR3 commands such as READ, WRITE, and REFRESH. It features a differential clock input, data input/output, power management, and control signals required for memory operations.
Additionally, it has a low voltage operation of 1.5V, providing improved power efficiency compared to earlier SDRAM technologies. The chip is designed for high-performance applications in computing and networking equipment.