K4A8G085WC-BCWE

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K4A8G085WC-BCWE

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  • HerstellerSamsung

  • Herstellerteil #K4A8G085WC-BCWE

  • Auf Lager5281

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Spezifikationen

Attribut Wert
Manufacturer Samsung
Package / Case FBGA-78

Übersicht

Description

The K4A8G085WC-BCWE is a high-performance mobile DRAM (Dynamic Random Access Memory) chip manufactured by Samsung. It features a capacity of 8 Gb (Gigabits) and is based on the LPDDR4 (Low Power Double Data Rate 4) technology, which offers enhanced speed and power efficiency for mobile devices. Operating at a voltage of 1.1V, it is designed to support demanding applications such as smartphones, tablets, and other portable electronics.
Key specifications include a data rate of up to 4266 Mbps, which enables fast data processing and improved multitasking capabilities. The device uses a 16-bit I/O interface, allowing for efficient data transfer. Additionally, its low power consumption is crucial for extending battery life in mobile applications. The K4A8G085WC-BCWE is also characterized by its compact packaging, making it suitable for space-constrained designs. Overall, this DRAM chip is an ideal choice for manufacturers looking to enhance performance and efficiency in next-generation mobile devices.

Equivalent

The K4A8G085WC-BCWE is a 1GB DDR3 SDRAM chip, commonly used in mobile devices. Equivalent products include:
1. Hynix H9CC4G8UDMPLR
2. Micron MT41K128M16HA-125
3. Samsung K4B4G0846F-BCK0
Ensure compatibility in terms of density, pin configuration, and memory specifications when considering alternatives.

Features

The K4A8G085WC-BCWE is a 1GB DDR3 SDRAM (Synchronous Dynamic Random Access Memory) chip, designed for high-performance applications. Key features include:
- Density: 1GB capacity, suitable for mobile devices and embedded applications.
- Data Rate: Operates at DDR3-1066/1333 speeds, offering improved performance over previous DDR standards.
- Package: Typically available in a small FBGA (Fine Ball Grid Array) package, allowing for compact integration into devices.
- Voltage: Operates at a low voltage of 1.5V, contributing to power efficiency and thermal management.
- Access Time: Efficient random access times help improve overall system performance.
- Organization: Configured in a x16 (16-bit) I/O organization, making it suitable for various applications.
This memory chip is ideal for use in smartphones, tablets, and other portable devices, where space and power efficiency are critical.

Pinout

The K4A8G085WC-BCWE is a DDR4 DRAM memory chip with a pin count of 96. It is designed for high-density memory applications, typically used in servers, desktops, and laptops. The primary function of this chip is to provide high-speed memory storage with a data rate of up to 2400 MT/s, facilitating fast data processing and efficient multitasking. The chip supports features such as low power consumption and improved performance over previous DDR generations, making it suitable for modern computing systems.

Manufacturer

The K4A8G085WC-BCWE is manufactured by Samsung Electronics, a South Korean multinational conglomerate. Samsung Electronics is a subsidiary of the larger Samsung Group and is one of the world's leading manufacturers of semiconductors, consumer electronics, and telecommunications equipment. The company is well-known for its innovations in various sectors including mobile devices, televisions, and home appliances, as well as for its significant contributions to memory chip production.
The K4A8G085WC-BCWE is a specific type of DRAM (Dynamic Random-Access Memory) chip, and Samsung is a key player in the global memory market, producing a wide range of memory solutions for various applications such as smartphones, computers, and industrial devices. By consistently investing in research and development, Samsung Electronics maintains a strong competitive edge and is recognized for its quality and reliability in semiconductor manufacturing.

Application

The K4A8G085WC-BCWE is a 1GB DDR3 SDRAM memory chip, commonly used in various applications including mobile devices, tablets, laptops, and embedded systems. It supports high-speed data transfer, making it suitable for consumer electronics where efficient multitasking and performance are critical. Additionally, it can be utilized in networking equipment, automotive applications, and industrial devices requiring reliable memory solutions. Its low power consumption also makes it ideal for battery-operated devices, enhancing overall energy efficiency.

Package

The K4A8G085WC-BCWE is a DRAM memory chip packaged in a 78-ball FBGA (Fine Ball Grid Array) format. This compact packaging allows for efficient space utilization on circuit boards, suitable for various applications in mobile and computing devices.

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