K4A8G085WC-BITD

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K4A8G085WC-BITD

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  • HerstellerSamsung

  • Herstellerteil #K4A8G085WC-BITD

  • Auf Lager2389

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90-Tage Kundendienstgarantie

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Spezifikationen

Attribut Wert
Manufacturer Samsung
Package / Case FBGA-78

Übersicht

Description

The K4A8G085WC-BITD is a high-performance DRAM (Dynamic Random Access Memory) component produced by Samsung. It is part of the LPDDR4 (Low Power Double Data Rate 4) family, designed for mobile and portable devices, providing enhanced speed and efficiency. This memory chip typically has a density of 8GB, making it suitable for smartphones, tablets, and other compact electronics that require substantial memory capacity while maintaining low power consumption.
Key features include a data rate of up to 4266 Mbps, improved bandwidth, and reduced latency, which are critical for multitasking and running demanding applications. Built with advanced manufacturing processes, the K4A8G085WC-BITD also supports various power-saving modes, contributing to longer battery life in mobile devices. Overall, it is an essential component for modern devices that require efficient and reliable memory solutions.

Equivalent

The K4A8G085WC-BITD is a 1GB DDR3 SDRAM chip. Equivalent products include:
1. Hynix H5TQ1G83AFR
2. Micron MT41K128M16HA-125
3. Samsung K4B2G1646F-BCK0
4. Nanya NT5CB256M16DP-DI
Check specifications for compatibility, as variations in timing, voltage, or package type may affect interchangeability.

Features

The K4A8G085WC-BITD is a 1GB DDR3 SDRAM memory module designed for high-performance applications. Key features include:
1. Density: 1GB capacity, suitable for mobile devices and embedded systems.
2. Speed: Operates at a data rate of 1066 MT/s (megatransfers per second), ensuring fast data access.
3. Bus Width: 8-bit architecture, allowing for efficient data transfer and processing.
4. Voltage: Operates at a low voltage of 1.5V, contributing to energy efficiency and heat reduction.
5. Package Type: Comes in a small form factor, typically a mobile package (like BGA), ideal for space-constrained applications.
6. Features: Supports features such as on-die termination (ODT) and temperature monitoring for enhanced performance and reliability.
This memory module is commonly used in smartphones, tablets, and other compact electronic devices where performance and power efficiency are critical.

Pinout

The K4A8G085WC-BITD is a 8 Gb (gigabit) DDR4 DRAM memory chip from Samsung. It features a pin count of 78 pins in a TFBGA (Thin Fine Ball Grid Array) package. This memory device operates at a voltage of 1.2V and supports data rates of up to 2400 MT/s (mega-transfers per second).
The primary function of this memory chip is to provide high-performance volatile storage for various computing applications, including smartphones, tablets, and laptops. It is designed for improved power efficiency and data bandwidth, making it suitable for both consumer electronics and enterprise-level applications. The K4A8G085WC-BITD is typically used in systems requiring fast data access and processing capabilities.

Manufacturer

The manufacturer of the K4A8G085WC-BITD is Samsung Electronics. Samsung is a South Korean multinational conglomerate known for its diverse range of products and services. Founded in 1938, it operates in various sectors, including consumer electronics, semiconductors, telecommunications, and more.
In the semiconductor industry, Samsung is one of the world's leading manufacturers, producing a wide array of memory products such as DRAM, NAND flash, and more. The K4A8G085WC-BITD is a specific type of DRAM memory chip, indicating Samsung's strong presence in memory technology, which is critical for computers, smartphones, and other electronic devices.
Samsung Electronics is also known for its innovation and investment in research and development, making it a key player in advancing technology and electronics globally. Overall, Samsung is recognized for its quality, reliability, and cutting-edge technology in various domains.

Application

The K4A8G085WC-BITD is a 1GB DDR3 SDRAM memory chip primarily used in mobile devices, digital consumer electronics, and industrial applications. Its typical applications include smartphones, tablets, laptops, and other portable computing devices where efficient power consumption and high-speed data access are crucial. Additionally, it can be utilized in automotive systems, IoT devices, and embedded systems requiring reliable memory solutions. The chip supports various data rates and is designed to enhance performance in multitasking environments.

Package

The K4A8G085WC-BITD is a mobile DRAM memory chip packaged in a 78-ball Fine Pitch Ball Grid Array (FBGA) format. This compact packaging is designed for high-density applications, commonly used in mobile devices and other electronic systems.

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