K4B4G1646E-BYMA0CV

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K4B4G1646E-BYMA0CV

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  • HerstellerSamsung

  • Herstellerteil #K4B4G1646E-BYMA0CV

  • Auf Lager5151

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90-Tage Kundendienstgarantie

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Spezifikationen

Attribut Wert
Manufacturer Samsung
Package / Case BGA

Übersicht

Description

"K4B4G1646E-BYMA0CV" appears to be a model number or product code, likely representing a specific type of electronic component or memory module, such as DRAM from a manufacturer like Samsung or another semiconductor company. Model numbers like these are typically used by manufacturers to categorize and identify products with specific configurations or specifications, such as memory size, speed, voltage, and physical form factor.
Understanding such a model number involves breaking it down:
- "K4B" could denote a specific series or family of products.
- "4G1646" might indicate capacity, technology, or other technical specifications.
- "E-BYMA0CV" could provide additional details about the module’s features, design, or revisions.
To gain detailed information about this specific component, you would generally refer to the manufacturer’s datasheet or technical documentation, which provides comprehensive details on performance, compatibility, and usage guidelines. This documentation is essential for engineers and designers who need to ensure that the component meets the requirements of their specific application or system design.

Equivalent

The K4B4G1646E-BYMA0CV is a DDR3 SDRAM chip by Samsung. Equivalent products generally include DDR3 SDRAM chips from other manufacturers with similar specifications such as 4Gb density, 1600 Mbps speed, and a 16-bit interface. Equivalent models could include offerings from Micron, Hynix (SK Hynix), Nanya, or Kingston, though exact model numbers may vary. Always verify specifications like speed, voltage, and package type for compatibility.

Pinout

The K4B4G1646E-BYMA0CV is a DRAM chip from Samsung, specifically belonging to the DDR3 SDRAM family. It typically comes in a FBGA (Fine-pitch Ball Grid Array) package. The pin count for this chip is 96 balls. The primary function of this chip is to provide high-speed, volatile memory storage in computing devices, which can be used for tasks requiring rapid data retrieval and temporary data storage.
This memory chip is designed for high performance and efficiency, commonly utilized in various applications such as laptops, desktops, and servers. It operates using a 1.5V power supply and supports high-speed data transfer rates, making it suitable for demanding computing environments. Additionally, the chip is designed to support standard DDR3 features, including auto-refresh and self-refresh modes, which help in maintaining data integrity and power efficiency.

Manufacturer

The K4B4G1646E-BYMA0CV is a DRAM memory chip manufactured by Samsung Electronics. Samsung Electronics is a South Korean multinational company that is one of the world's largest producers of electronic devices. The company is a major player in various sectors, including semiconductors, consumer electronics, telecommunications equipment, and home appliances. Samsung is well-known for its innovation and leadership in the technology industry, often recognized for its advancements in memory chips, smartphones, televisions, and display panels.

Application

The K4B4G1646E-BYMA0CV is a DRAM chip, specifically a 4Gb DDR3L SDRAM, used primarily in computing and electronic applications where efficient data processing and storage are critical. Its application areas include:
1. Computers and Laptops: Enhances system memory for improved performance.
2. Servers: Supports high-speed data processing and multitasking.
3. Embedded Systems: Utilized in devices requiring reliable and efficient memory solutions.
4. Networking Equipment: Contributes to high-speed data transfer and handling.
5. Consumer Electronics: Found in devices like gaming consoles and smart TVs for optimized performance.
These areas benefit from the chip's low power consumption and high speed.

Package

The package type for the Samsung K4B4G1646E-BYMA0CV is a 96-ball FBGA (Fine-Pitch Ball Grid Array). This type of package is commonly used for DRAM chips, offering a high-density configuration suitable for compact and efficient electronic designs.

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