K4S561632N-LC75

Abbildungen dienen nur als Referenz

K4S561632N-LC75

+Stückliste

  • HerstellerJLCPCB-Baugruppe

  • Herstellerteil #K4S561632N-LC75

  • Auf Lager22054

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Manufacturer JLCPCB Assembly
Package / Case TSOP-54

Übersicht

Equivalent

The K4S561632N-LC75 is a 256Mb (16Mx16) SDRAM chip. Equivalent alternatives include:
- HYB39S56160F(L)T-7.5 (Infineon)
- MT48LC16M16A2-75 (Micron)
- IS42S16160B-7TL (ISSI)
- EM63A165TS-7.5 (Etron)
These are pin-compatible 3.3V, 16Mx16 SDRAMs with similar speed grades (7.5ns). Verify datasheets for exact compatibility.

Manufacturer

The K4S561632N-LC75 is a 256Mb (16Mx16) SDRAM manufactured by Samsung Electronics.
Samsung is a South Korean multinational conglomerate and a leading global producer of semiconductors, memory chips, and consumer electronics. It is one of the largest memory chip manufacturers in the world, known for its DRAM, NAND flash, and other semiconductor products.
The K4S561632N-LC75 is an older-generation SDRAM, typically used in embedded systems, networking equipment, and industrial applications. Samsung continues to be a dominant player in the memory market, supplying high-performance chips for modern computing and mobile devices.

Application

The K4S561632N-LC75 is a 256Mb (16Mx16) SDRAM chip commonly used in:
1. Consumer Electronics – TVs, set-top boxes, gaming consoles.
2. Networking Equipment – Routers, switches, modems.
3. Embedded Systems – Industrial controllers, automation devices.
4. Computing – Low-power PCs, legacy systems.
5. Automotive – Infotainment, navigation systems.
It offers high-speed data transfer (PC133) and low power consumption, making it suitable for cost-sensitive, performance-driven applications.

Package

The K4S561632N-LC75 is a 256Mb (16Mx16) SDRAM chip in a 54-pin TSOP-II package. It operates at 3.3V and is commonly used in embedded systems and consumer electronics. The TSOP-II (Thin Small Outline Package) type is surface-mounted, compact, and suitable for high-density PCB designs.

Frequently Asked Questions


Q: What is the memory organization of the K4S561632N-LC75?
A: It is organized as 4 banks x 4M x 16 bits, totaling 256Mb of SDRAM.


Q: What is the speed grade indicated by -LC75?
A: -LC75 indicates a maximum clock frequency of 133 MHz (7.5 ns cycle time) at CL=3.


Q: Is this component compatible with 3.3V logic levels?
A: Yes, it operates with a 3.3V ±0.3V core and I/O supply voltage.


Q: What package type does the K4S561632N-LC75 use?
A: It uses a standard 54-pin TSOP-II (Thin Small Outline Package) with 0.8mm pitch.


Q: Can this SDRAM be used in automotive or industrial temperature ranges?
A: The standard version operates at commercial temperature (0°C to 70°C); check specific datasheet for extended options.


Q: What is the typical self-refresh current consumption?
A: Typical self-refresh current is around 800μA to 1mA, depending on temperature and voltage conditions.


Q: Does this part support burst read/write operation?
A: Yes, it supports programmable burst lengths of 1, 2, 4, 8, or full page.


Produkte, die mit K4S561632N-LC75 zusammenhängen

  • Schnellangebot

  • Senden Sie Ihre Angebotsanfrage für K4S561632N-LC75 Mit diesem Formular können Sie uns innerhalb von 12 Stunden kontaktieren.