KLM4G1FEPD-B031

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KLM4G1FEPD-B031

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  • HerstellerJLCPCB-Baugruppe

  • Herstellerteil #KLM4G1FEPD-B031

  • Auf Lager9960

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Attribut Wert
Manufacturer JLCPCB Assembly
Package BGA-153_11.5x13mm

Übersicht

Description

KLM4G1FEPD-B031 is a 4GB DDR3 SDRAM (Double Data Rate Synchronous Dynamic Random Access Memory) module produced by Samsung. It is typically used in various computing devices, including laptops and desktops, to enhance performance and increase memory capacity. This specific model operates at a voltage of 1.5V and supports a 1333 MHz or 1600 MHz speed, depending on the system's compatibility.
The "KLM" prefix indicates that it is a part of Samsung's memory product line, with "4G" signifying the capacity, and "FEPD" referring to the specific memory configuration and design. DDR3 memory is known for its improved speed and efficiency compared to previous DDR2 standards, making it suitable for multitasking and demanding applications.
When upgrading or replacing RAM, it's essential to ensure compatibility with the motherboard and other hardware specifications to achieve optimal performance.

Equivalent

The KLM4G1FEPD-B031 chip is a 4Gb LPDDR3 memory chip. Equivalent products include:
1. Samsung K4G4G16FEC-BCRC
2. Micron MT42L1G4DAF
3. Hynix H5TQ4G63AFR
4. Nanya NT4G4T2HB-3C
These alternatives provide similar specifications and functionality, suitable for applications requiring LPDDR3 memory solutions. Always verify compatibility with specific devices.

Features

The KLM4G1FEPD-B031 is a high-performance DRAM memory module designed for various applications, including servers and high-end computing systems. Key features include:
1. Capacity: 4GB DDR3 SDRAM, providing ample memory for efficient multitasking and performance.
2. Speed: Operates at a frequency of 1600 MHz, ensuring quick data transfer rates.
3. Form Factor: SO-DIMM, making it suitable for laptops and compact systems.
4. Voltage: Low voltage operation at 1.35V, which contributes to energy efficiency.
5. Data Transfer Rate: Supports a transfer rate of 12800 MB/s, enhancing overall system responsiveness.
6. Compatibility: Typically compatible with various motherboards that support DDR3 memory.
7. Latency: Offers a CL (CAS Latency) rating of 11, balancing speed and latency for optimal performance.
Overall, the KLM4G1FEPD-B031 is a reliable and efficient memory solution for users seeking to improve their system's performance.

Pinout

The KLM4G1FEPD-B031 is a 4 Gb (Gigabit) DDR3 memory chip produced by Samsung. It has a standard pin count of 78 pins. This memory device is designed for mobile applications and is utilized in smartphones, tablets, and other portable devices.
The functions of the KLM4G1FEPD-B031 include storing data and executing operations in mobile computing environments. It features a low voltage operation (1.2 V) for power efficiency, supports data rates of up to 1600 MT/s (megatransfers per second), and utilizes a double data rate architecture, allowing it to transfer data on both the rising and falling edges of the clock signal. This helps achieve higher bandwidth and improved performance in multitasking and data-intensive applications.
Overall, the KLM4G1FEPD-B031 plays a critical role in enhancing the performance and efficiency of mobile devices.

Manufacturer

The KLM4G1FEPD-B031 is manufactured by KLEEV, a brand known for producing memory and storage solutions. KLEEV, part of the larger KLEEV Technology Co., Ltd., focuses on high-performance memory products, including DRAM modules and solid-state drives (SSDs). The company is recognized for its commitment to quality and innovation in the consumer electronics sector, catering primarily to gamers, PC builders, and tech enthusiasts. KLEEV's products often emphasize high speed, reliability, and aesthetic design, appealing to users who value performance and style in their computing devices.

Application

The KLM4G1FEPD-B031 is a 4GB DDR3 SDRAM memory module, primarily used in various consumer electronics and computing applications. Key areas include personal computers, laptops, and servers, where it enhances performance by providing faster data access. It is also utilized in gaming systems, embedded devices, and mobile computing solutions, offering reliable memory support for multitasking and demanding applications. Additionally, its compatibility with various motherboards makes it suitable for upgrades and repairs in existing systems.

Package

The KLM4G1FEPD-B031 is a NAND flash memory chip packaged in a 153-ball FBGA (Fine Ball Grid Array) form factor. This type of packaging is designed for compactness and efficient thermal performance, making it suitable for mobile devices and applications where space is limited.

Frequently Asked Questions


Q: Is this component a NAND Flash memory device?
A: Yes, based on the part number prefix KLM4G, it is typically an eMMC NAND Flash memory, commonly used for embedded storage.


Q: What is the storage capacity of the KLM4G1FEPD-B031?
A: The "4G" in the part number generally indicates 4GB of raw NAND storage density, but usable capacity may vary by formatting.


Q: What is the package type and size for this component?
A: It comes in a BGA-153 package with dimensions of 11.5mm x 13mm, suitable for surface-mount assembly.


Q: Can this eMMC be used in industrial temperature range applications?
A: Without specified lifecycle or temperature grade, assume commercial temperature range; verify with JLCPCB for industrial suitability.


Q: Is this component compatible with standard eMMC interface protocols?
A: Yes, eMMC devices typically support JEDEC standard interface, but confirm specific revision and speed mode from datasheet.


Q: Does JLCPCB Assembly manufacture this component?
A: JLCPCB Assembly is likely a distributor or assembly service; the original manufacturer may be Samsung, based on the part number prefix.


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