KLM4G1YEMD-B031

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KLM4G1YEMD-B031

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  • HerstellerJLCPCB-Baugruppe

  • Herstellerteil #KLM4G1YEMD-B031

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Spezifikationen

Attribut Wert
Manufacturer JLCPCB Assembly
Package / Case 153-FBGA

Übersicht

Equivalent

Equivalent products to the KLM4G1YEMD-B031 (Samsung eMMC chip) include:
- KLM4G1FEPD-B031 (Samsung)
- MTFC4GACAJCN-4M (Micron)
- THGBM4G4D1HBAIR (Toshiba/Kioxia)
- SDINBDA4-8G (Western Digital/SanDisk)
These are 4GB eMMC 5.0/5.1 chips with similar specs. Verify pin compatibility and datasheets before substitution.

Features

The KLM4G1YEMD-B031 is a 4GB DDR4 memory module with the following key features:
- Capacity: 4GB
- Type: DDR4
- Speed: 2133 MHz (may vary by configuration)
- Voltage: 1.2V (low power consumption)
- Form Factor: 260-pin SODIMM (for laptops/small devices)
- CAS Latency: Typically CL15-CL17
- ECC: Non-ECC (error correction not supported)
- Density: Single-rank or dual-rank (varies by batch)
- Compatibility: Designed for Intel/AMD systems
Ideal for budget-friendly upgrades in laptops and compact PCs. Check manufacturer specs for exact compatibility.

Pinout

The KLM4G1YEMD-B031 is a 153-ball FBGA (Fine-pitch Ball Grid Array) package eMMC (embedded MultiMediaCard) chip. Key functions include:
- Pin Count: 153 balls (11.5mm x 13mm package).
- Function: NAND flash-based storage with an integrated controller, compliant with eMMC 5.1 standard.
- Interface: 8-bit parallel data bus (supports HS400 mode for high-speed transfer).
- Capacity: 4GB (32Gbit).
- Applications: Embedded systems, smartphones, tablets, and IoT devices requiring reliable onboard storage.
The pins include power (VCC, VCCQ), ground (VSS), data lines (DAT[7:0]), clock (CLK), command (CMD), and reset (RST_n). No external memory controller is needed due to the built-in controller.

Manufacturer

The KLM4G1YEMD-B031 is manufactured by Samsung, a South Korean multinational conglomerate known for its electronics, semiconductors, and memory products. Samsung is a global leader in technology, producing components like NAND flash memory, SSDs, and DRAM modules. The company is renowned for innovation and high-quality manufacturing in the tech industry.

Application

The KLM4G1YEMD-B031 is a high-performance NAND flash memory chip, primarily used in:
- Consumer Electronics: Smartphones, tablets, digital cameras.
- Computing: SSDs, USB drives, memory cards.
- Embedded Systems: IoT devices, industrial automation.
- Automotive: Infotainment, ADAS, telematics.
- Data Storage: Enterprise storage, cloud servers.
Its reliability and speed make it suitable for applications requiring fast, durable, and high-capacity storage.

Package

The KLM4G1YEMD-B031 is a BGA (Ball Grid Array) package type, commonly used for memory modules like eMMC (embedded MultiMediaCard). It features a compact, surface-mount design with solder balls on the underside for connectivity, ideal for space-constrained applications. The exact dimensions and ball count may vary, so refer to the datasheet for specifics.

Frequently Asked Questions


Q: Is this component suitable for high-density PCB designs?
A: Yes, the 153-FBGA package is designed for high-density interconnects, ideal for space-constrained applications.


Q: What type of memory device is the KLM4G1YEMD-B031?
A: It is a storage component, typically an eMMC or NAND flash memory, for data storage in embedded systems.


Q: Can I use this part for prototype assembly by JLCPCB?
A: Yes, as it is listed under JLCPCB Assembly, it is compatible with their assembly service for prototypes.


Q: Does the 153-FBGA package require specialized soldering equipment?
A: Yes, FBGA packages need reflow soldering with precise temperature control for proper ball attachment.


Q: Is this component recommended for consumer electronics?
A: Likely yes, as eMMC flash memory is commonly used in smartphones, tablets, and embedded devices.


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