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IC FPGA 206 I/O 256FTBGA
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HerstellerLattice Semiconductor Corporation
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Herstellerteil #LCMXO2-2000HC-4FTG256C
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Datenblatt LCMXO2-2000HC-4FTG256C DataSheet
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Paket LBGA-256
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Auf Lager1569
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | MachXO2 |
| Part Status | Active |
| Number of LABs/CLBs | 264 |
| Number of Logic Elements/Cells | 2112 |
| Total RAM Bits | 75776 |
| Number of I/O | 206 |
| Voltage - Supply | 2.375V ~ 3.465V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Übersicht
Equivalent
1. Lattice LCMXO2-2000HC-4FTG256I (Industrial-grade variant).
2. Lattice LCMXO2-4000HC-4FTG256C (Higher density, same package).
3. Lattice ICE40LP1K-CM121 (Lower-cost FPGA, different architecture).
4. Xilinx XC6SLX9-2FTG256C (Spartan-6, similar logic capacity).
Check pin compatibility and features before substitution. For exact replacements, consult Lattice's cross-reference tools or distributors.
Features
- Logic Capacity: 2112 LUTs (Look-Up Tables).
- Memory: 56.5 Kbits embedded RAM.
- I/O Pins: 206 user I/Os (supports LVCMOS, LVTTL, PCI, and more).
- Package: 256-ball Fine-pitch Ball Grid Array (ftBGA).
- Non-Volatile Configuration: Flash-based, no external boot memory needed.
- Power Efficiency: Ultra-low static power (~19 µW typical).
- On-Chip Features: PLL, hardened I²C, SPI, and timer/counter blocks.
- Operating Voltage: 1.2V core, 1.2V–3.3V I/O.
- Temperature Range: Commercial (0°C to 85°C).
Ideal for low-power, cost-sensitive applications like consumer electronics, industrial control, and bridging interfaces.
Pinout
- Pin Count: 256-pin (Fine-pitch Ball Grid Array, FTG256 package).
- Function: A low-power, instant-on FPGA with 2112 LUTs, 92 KB embedded RAM, and 66 KB user flash. It supports I/O expansion, bridging, and control applications with features like SPI, I²C, and LVDS support.
- Voltage: 1.2V core voltage, supports 1.2V to 3.3V I/O.
- Typical Use Cases: Interface bridging, system configuration, and power management.
Application
- Embedded Systems – Interface bridging, GPIO expansion.
- Consumer Electronics – Smart devices, wearables.
- Industrial Control – Sensor interfacing, motor control.
- Communications – Protocol conversion (I2C, SPI, UART).
- Automotive – Infotainment, driver assistance.
Its small form factor, low power, and instant-on capability suit portable and power-sensitive applications.
