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LFE5U-25F-6BG256I
+StücklisteIC FPGA 197 I/O 256CABGA
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HerstellerLattice Semiconductor Corporation
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Herstellerteil #LFE5U-25F-6BG256I
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Datenblatt LFE5U-25F-6BG256I DataSheet
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Paket CABGA-256
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Auf Lager4994
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | ECP5 |
| Part Status | Active |
| Number of LABs/CLBs | 6000 |
| Number of Logic Elements/Cells | 24000 |
| Total RAM Bits | 1032192 |
| Number of I/O | 197 |
| Voltage - Supply | 1.045V ~ 1.155V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Key features include:
- 24,624 Look-Up Tables (LUTs) for logic implementation.
- Up to 1.8 Mb of embedded memory for data storage.
- Support for multiple I/O standards, including LVDS, LVCMOS, and more.
- DSP blocks for high-speed arithmetic operations, beneficial for signal processing tasks.
- Integrated PLLs for clock management and synchronization.
- The "-6" speed grade indicates its performance rating within the ECP5 family.
- Operates in an industrial temperature range (denoted by the "I" suffix).
- Packaged in a 256-ball grid array (BGA), providing a compact form factor.
The LFE5U-25F-6BG256I is engineered to enhance design flexibility while minimizing power consumption, making it an excellent choice for various modern applications demanding efficient processing capabilities.
Equivalent
1. Xilinx Artix-7 series, which offers similar logic capacity and performance.
2. Intel Cyclone V FPGAs, which also target low-power applications.
3. Microsemi IGLOO2 FPGAs, designed for low power and cost-sensitive applications.
These alternatives vary in specific features, so evaluating based on exact application requirements is crucial.
Features
1. Logic Resources: It offers 24,640 Look-Up Tables (LUTs), providing ample logic capacity for complex designs.
2. Low Power Consumption: Optimized for low power, making it suitable for battery-powered and heat-sensitive applications.
3. Package: Available in a 256-ball grid array (BGA) package, facilitating integration into compact designs.
4. I/O Pins: Includes a wide range of I/O standards and interfaces, with up to 118 user I/O pins.
5. Clock Management: Supports multiple clock networks and PLLs for flexible clock management solutions.
6. Memory: Features embedded block RAM and distributed RAM for efficient data storage and management.
7. SERDES: Contains up to four high-speed SERDES channels for data serialization/deserialization functions.
8. Temperature Range: The industrial temperature range of -40°C to 100°C ensures reliability in harsh environments.
These features make it a versatile choice for applications in communications, consumer electronics, and industrial automation.
Pinout
Manufacturer
Application
1. Communications: Used in wireless infrastructure, base stations, and small cells.
2. Industrial Automation: Supports machine vision systems and industrial networking.
3. Consumer Electronics: Suitable for smart TVs, set-top boxes, and gaming devices.
4. Automotive: Applied in infotainment systems and advanced driver-assistance systems (ADAS).
5. IoT Devices: Facilitates connectivity and processing in IoT gateways and edge devices.
Its low power consumption, high I/O density, and compact form factor make it ideal for these applications.