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LFE5U-25F-7BG256I
+StücklisteIC FPGA 197 I/O 256CABGA
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HerstellerLattice Semiconductor Corporation
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Herstellerteil #LFE5U-25F-7BG256I
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Paket LFBGA-256
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Auf Lager4192
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Supplier | Lattice Semiconductor Corporation |
| Package / Case | Tray |
| Series | ECP5 |
| Part Status | Active |
| Number of LABs/CLBs | 6000 |
| Number of Logic Elements/Cells | 24000 |
| Total RAM Bits | 1032192 |
| Number of I/O | 197 |
| Voltage - Supply | 1.045V ~ 1.155V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
Übersicht
Description
Features
- 25K logic elements
- 256-ball BGA package (BG256I)
- Speed grade -7
- Industrial temperature range (-40°C to 85°C)
- On‑chip memory blocks and DSP slices
- PLLs and clock management resources
- Multiple I/O banks with support for common standards (LVDS/LVCMOS/LVTTL, etc.)
- SERDES capable transceivers for high‑speed links
- Flexible I/O voltage and bank structure
- Low‑power design optimized for cost-sensitive mid‑range apps
- Supported by Lattice Radiant design software with built‑in IP catalog
Applications: data path, control, signal processing, communications, and other mid‑range FPGA tasks.
Pinout
- Function: FPGA—Lattice LFE5U-25F (ECP5 family), ~25K logic elements, industrial temperature range (I), speed grade 7.
Manufacturer
- What kind of company: A US-based semiconductor company that designs, manufactures, and sells programmable logic devices (PLDs), including low-power FPGAs and related IP for industries such as communications, automotive, consumer electronics, and industrial.
Application
- Industrial automation and motor control (PLCs, drives, I/O)
- Embedded control and sensor processing (conditioning, accelerators)
- Communications and data paths (high-speed serial interfaces, protocol bridging)
- Video, image processing and camera interfaces (pre/post processing)
- Data acquisition, instrumentation and test equipment
- Prototyping and low-volume production (custom logic, hardware accelerators)
- Automotive and rugged embedded systems (low power, compact package)