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LPC1830FBD144,551
+StücklisteIC MCU 32BIT ROMLESS 144LQFP
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HerstellerNXP USA Inc.
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Herstellerteil #LPC1830FBD144,551
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Datenblatt LPC1830FBD144,551 DataSheet
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Paket LQFP-144
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Auf Lager9284
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Supplier | Rochester Electronics, LLC,NXP USA Inc. |
| Package | Bulk,Tray |
| Series | LPC18xx |
| ProductStatus | Active |
| CoreProcessor | ARM® Cortex®-M3 |
| CoreSize | 32-Bit Single-Core |
| Speed | 180MHz |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
| NumberofI/O | 83 |
| ProgramMemoryType | ROMless |
| RAMSize | 200K x 8 |
| Voltage-Supply(Vcc/Vdd) | 2.2V ~ 3.6V |
| DataConverters | A/D 8x10b; D/A 1x10b |
| OscillatorType | Internal |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 144-LQFP |
