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LSM6DS3HTR
+StücklisteIMU ACCEL/GYRO/TEMP I2C/SPI LGA
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HerstellerSTMikroelektronik
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Herstellerteil #LSM6DS3HTR
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Paket LGA-14
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Auf Lager3290
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Obsolete |
| SensorType | Accelerometer, Gyroscope, Temperature, 6 Axis |
| OutputType | I²C, SPI |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| Package/Case | 14-VFLGA Module |
| SupplierDevicePackage | 14-LGA (2.5x3) |
Übersicht
Description
This IMU features a full-scale range of ±2/±4/±8/±16 g for the accelerometer and ±125/±245/±500/±1000/±2000 dps for the gyroscope. It supports both I2C and SPI communication interfaces, providing flexibility in connecting with microcontrollers and other digital systems. The LSM6DS3HTR also includes a programmable interrupt generator, FIFO (First In, First Out) memory buffer, and embedded temperature sensor, aiding in efficient and precise data collection and processing.
With its embedded pedometer and significant motion detection functions, this sensor is well-suited for applications requiring movement tracking and gesture recognition. Its compact size and robust performance make it a popular choice in the realm of consumer electronics and IoT devices.
Equivalent
Pinout
1. VDD: Supply voltage (1.71V to 3.6V).
2. VDDIO: I/O pins supply voltage.
3. GND: Ground.
4. SA0/SDO: SPI serial data output (SDO) or I2C least significant bit of the device address (SA0).
5. SCL/SPC: I2C serial clock (SCL) or SPI serial port clock (SPC).
6. SDA/SDI/SDO: I2C serial data (SDA) or SPI serial data input (SDI) and output (SDO).
7. CS: SPI enable (Chip Select).
8. INT1: Interrupt 1 signal.
9. INT2: Interrupt 2 signal.
10. - 14. NC: No connection.
These pins facilitate communication via I2C and SPI interfaces, while the interrupt pins are used for signaling events like data ready, FIFO overrun, or significant motion detection.
Manufacturer
STMicroelectronics is headquartered in Geneva, Switzerland, and operates globally with multiple research and development facilities, as well as manufacturing sites around the world. The company is publicly traded and has a reputation for innovation in the semiconductor industry, often working on advancements in sensor technologies, microelectronics, and integrated circuits.