MCIMX6G3CVK05AB

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MCIMX6G3CVK05AB

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IC MPU I.MX6UL 272BGA

  • HerstellerNXP USA Inc.

  • Herstellerteil #MCIMX6G3CVK05AB

  • Paket LFBGA-272

  • Auf Lager5051

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Supplier NXP USA Inc.
Package / Case Tray
Series i.MX6UL
Part Status Active
Core Processor ARM® Cortex®-A7
Number of Cores / Bus Width 1 Core, 32-Bit
Speed 528MHz
Co - Processors / DSP Multimedia; NEON™ SIMD
RAM Controllers LPDDR2, DDR3, DDR3L
Graphics Acceleration No
Display&Interface Controllers LCD, LVDS
Ethernet 10/100Mbps (2)
USB USB 2.0 + PHY (2)
Voltage - I / O 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature -40°C ~ 105°C (TJ)
Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

Übersicht

Description

MCIMX6G3CVK05AB is an NXP i.MX 6-based development kit/module used to evaluate and prototype embedded multimedia and control applications. It targets the i.MX 6 family and provides standard interfaces such as USB, Ethernet, HDMI/LCD, camera, audio, GPIO, and storage options (microSD/eMMC). The kit runs Linux, Android, and other OSes with BSP support from NXP and the community. It includes onboard memory, boot flash, and I/O connectors, designed to mount on a carrier/baseboard for rapid prototyping. For exact specifications (CPU cores, clock, memory size, I/O), refer to the official datasheet and user guide for MCIMX6G3CVK05AB, since revisions vary.

Equivalent

Direct cross-reference SKUs for MCIMX6G3CVK05AB don’t exist; it’s a specific i.MX6 G3 module. Closest equivalents are other i.MX6-series modules with similar Cortex‑A9 performance, such as i.MX6S (Solo), i.MX6D (Dual), and i.MX6Q (Quad) variants from NXP or distributors, matched to the same package and memory. For exact equivalents, use NXP’s cross-reference tools based on the module’s CPU, RAM, interfaces, and form-factor.

Pinout

Pin count and pin functions depend on the specific package variant of MCIMX6G3CVK05AB. Please provide the datasheet or confirm the exact package (e.g., BGA/LQFP size) so I can give the exact pin count and a pin-by-pin function list.

Manufacturer

- Manufacturer: NXP Semiconductors
- What kind of company: Dutch multinational semiconductor company that designs and manufactures embedded processors (e.g., i.MX series), microcontrollers, and other ICs for automotive, industrial, and consumer applications.

Application

- Automotive infotainment and instrument clusters
- Industrial automation, HMI and control systems
- Digital signage, kiosks and retail displays
- Medical devices and imaging/monitoring applications
- Consumer electronics: set-top boxes, media players, cameras
- Smart home, IoT gateways and edge devices
- Robotics, vision systems and embedded sensors
- Drones and portable multimedia devices

Package

FBGA (ball grid array) package.

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