MGM210PB22JIA2R

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MGM210PB22JIA2R

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RF TXRX MOD 802.15.4 BT CHIP SMD

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Spezifikationen

Attribut Wert
Series Mighty Gecko
Part Status Active
RF Family / Standard 802.15.4, Bluetooth
Protocol Bluetooth v5.3, Thread, Zigbee®
Modulation DSSS, GFSK, O-QPSK
Frequency 2.4GHz ~ 2.4835GHz
Data Rate 2Mbps
Power - Output 10dBm
Sensitivity -104.5dBm
Serial Interfaces ADC, GPIO, I2C, I2S, IrDA, PWM, SPI, UART
Antenna Type Integrated, Chip
Utilized IC / Part EFR32MG21
Memory Size 1MB Flash, 96kB RAM
Voltage - Supply 1.71V ~ 3.8V
Current - Receiving 9.1mA ~ 9.9mA
Current - Transmitting 16.1mA ~ 34.1mA
Mounting Type Surface Mount
Operating Temperature -40°C ~ 125°C (TA)
Package / Case 31-SMD Module
Base Product Number MGM210
Digi Key Programmable Not Verified

Übersicht

Description

The MGM210PB22JIA2R is a part of the MGM210P series of wireless Gecko modules developed by Silicon Labs. These modules are designed for IoT applications with a focus on Bluetooth connectivity, specifically Bluetooth Low Energy (BLE). They integrate an ARM Cortex-M33 processor, which offers a balance of performance and energy efficiency, making them suitable for battery-operated devices.
The module includes a robust set of features such as secure boot and secure debug, ensuring reliable and secure operation in various environments. Additionally, it supports a wide range of peripherals, enhancing its versatility for different applications. The MGM210PB22JIA2R is engineered to provide a high level of RF performance, ensuring reliable communication over extended ranges.
Developers can leverage Silicon Labs' software development tools, including the Simplicity Studio, to streamline application development and testing. Overall, the MGM210PB22JIA2R is a powerful, compact solution for developers looking to integrate BLE connectivity into their IoT products.

Equivalent

The MGM210PB22JIA2R is a wireless SoC by Silicon Labs, based on the EFR32MG21 family. Equivalent products might include other EFR32MG21 variants or similar wireless SoCs from competitors like the Nordic Semiconductor nRF52840, Texas Instruments CC2652, or NXP's QN9080 series. These chips offer comparable features such as multi-protocol support and low power consumption, but specific equivalency depends on detailed application requirements. Always compare specifications to ensure they meet your needs.

Features

The MGM210PB22JIA2R is a microcontroller unit (MCU) from Silicon Labs, part of the EFR32MG21 series, designed for wireless communication applications. Key features include:
1. Processor: It incorporates an ARM Cortex-M33 core, providing a balance of performance and energy efficiency.
2. Wireless Capabilities: Supports Bluetooth, Zigbee, and Thread protocols, making it suitable for IoT applications.
3. Memory: Offers up to 512 KB of Flash memory and 64 KB of RAM, providing ample space for application code and data.
4. Security: Equipped with hardware security features, including Secure Boot and Crypto accelerators, ensuring robust security for connected devices.
5. Power Efficiency: Designed for low power consumption, ideal for battery-operated devices.
6. Development Support: Compatible with Silicon Labs' Simplicity Studio, offering tools for development and debugging.
7. I/O Options: Includes various peripherals such as ADC, DAC, UART, SPI, and I2C interfaces for flexible connectivity options.
These features make the MGM210PB22JIA2R suitable for developing secure, efficient, and versatile wireless applications in the IoT space.

Pinout

The MGM210PB22JIA2R is a module from Silicon Labs, part of the MGM210P Series, which is designed for wireless IoT applications. This particular module is based on the EFR32MG21 system-on-chip (SoC) and supports multiprotocol capabilities including Zigbee, Thread, and Bluetooth Low Energy (BLE).
The module comes in a compact form factor with a Land Grid Array (LGA) package. It features 51 GPIO (General Purpose Input/Output) pins, which can be configured for various peripheral interfaces such as I2C, SPI, UART, PWM, and ADC, depending on the application needs. Additionally, the module includes integrated components like an RF transceiver, power amplifier, and antenna or antenna interface, which aid in wireless communication.
The MGM210PB22JIA2R is designed to enable developers to quickly implement robust and secure wireless networking features into their IoT products, leveraging its low power consumption and extensive range of supported protocols.

Manufacturer

The MGM210PB22JIA2R is manufactured by Silicon Labs. Silicon Labs, officially known as Silicon Laboratories Inc., is a technology company that specializes in the design and development of semiconductors, software, and hardware solutions. Founded in 1996 and headquartered in Austin, Texas, the company is known for its focus on Internet of Things (IoT) connectivity, including wireless communication protocols like Bluetooth, Zigbee, Thread, and Wi-Fi. Silicon Labs provides products and solutions that cater to various industries, including industrial automation, smart home, consumer electronics, and automotive. Their offerings include microcontrollers, wireless chips, sensors, and software tools designed to support and enhance IoT applications.

Application

The MGM210PB22JIA2R is a wireless SoC designed for low-power IoT applications. It is commonly used in smart home devices, wearable technology, health and fitness monitors, industrial automation, and asset tracking systems. Its capabilities in Bluetooth connectivity make it ideal for applications requiring reliable wireless communication, such as remote controls, security systems, and lighting controls. Additionally, its low power consumption and robust performance support battery-operated devices that demand energy efficiency and longevity. Overall, it serves well in any application that requires wireless connectivity with low power requirements.

Package

The MGM210PB22JIA2R is a module from Silicon Labs, specifically part of their EFR32MG21 family of devices. It is typically provided in a compact surface-mount package designed for integration in IoT applications, featuring wireless communication capabilities. For specific package details, it is best to refer to the manufacturer’s datasheet for precise dimensions and characteristics.

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