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MT28EW01GABA1HJS-0SIT
+StücklisteIC FLASH 1GBIT PARALLEL 56TSOP
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HerstellerMicron Technology Inc.
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Herstellerteil #MT28EW01GABA1HJS-0SIT
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Auf Lager5416
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
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Spezifikationen
| Attribut | Wert |
| PartStatus | Active |
| BaseProductNumber | MT28EW01 |
| DigiKeyProgrammable | Not Verified |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NOR |
| MemorySize | 1Gbit |
| MemoryOrganization | 128M x 8, 64M x 16 |
| MemoryInterface | Parallel |
| WriteCycleTime-Word,Page | 60ns |
| Voltage-Supply | 2.7V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package | 56-TFSOP (0.724", 18.40mm Width) |
| SupplierDevicePackage | 56-TSOP |
| Packaging | Tray |
| AccessTime | 95 ns |
Übersicht
Description
Key features of the MT28EW01GABA1HJS-0SIT include a robust data retention capability, high endurance with a large number of program/erase cycles, and efficient power consumption, making it suitable for battery-powered devices. The chip supports error correction code (ECC) algorithms to ensure data integrity, and its small form factor allows for compact system designs.
The MT28EW01GABA1HJS-0SIT operates over a wide temperature range, enhancing its suitability for industrial environments. Its advanced architecture provides fast data transfer rates, optimizing the performance of the end applications. This NAND Flash is a reliable choice for developers seeking dependable and efficient memory solutions.
Equivalent
Features
The device is designed with a parallel NAND interface, promoting faster data transfer rates. It also includes error correction code (ECC) support to enhance data integrity and reliability. This NAND Flash memory is capable of operating within a wide temperature range, typically from -40°C to 85°C, ensuring performance stability in harsh conditions.
The MT28EW01GABA1HJS-0SIT comes in a TSOP (Thin Small Outline Package) type I package, which is compact and suitable for space-constrained applications. Overall, this chip is well-suited for applications requiring robust data storage with reliable performance.
Pinout
This type of memory is often used in embedded systems, automotive applications, and other devices where high-speed read capabilities are necessary. Key features include fast random access times, uniform sector architecture, and advanced security features like password protection and block locking.
The pinout for such devices generally includes pins for address lines, data lines, power supply (VCC), ground (VSS), write protection, output enable, chip enable, and write enable, among others. Each pin is dedicated to a specific function that supports the seamless operation of the memory chip in various applications.
Manufacturer
Application
1. Embedded Systems: Utilized for code storage in microcontrollers and processors in industrial automation and consumer electronics.
2. Automotive: Provides firmware storage for infotainment systems, advanced driver-assistance systems (ADAS), and engine control units (ECUs).
3. Networking: Used in routers and switches for configuration and firmware updates.
4. Medical Devices: Stores critical parameters and software in diagnostic equipment.
5. Aerospace and Defense: Offers reliable memory solutions for mission-critical applications where durability and data retention are crucial.
Package
Frequently Asked Questions
Q: What is the memory density and organization of this NOR Flash?
A: It is a 1Gbit (128M x 8 or 64M x 16) Non-Volatile NOR Flash memory, organized for flexible data access.
Q: What is the operating voltage range for this component?
A: It operates reliably with a voltage supply of 2.7V to 3.6V, suitable for standard 3V systems.
Q: What is the maximum access time and write speed?
A: It features a 95 ns access time and a word/page write cycle time of 60ns for fast read/write performance.
Q: What is the operating temperature range for industrial use?
A: It is rated for an industrial temperature range of -40°C to +85°C (TA), ensuring stability in harsh environments.
Q: What package type does this device come in?
A: It is supplied in a 56-TFSOP (18.40mm width) surface mount package, compatible with a 56-TSOP footprint.
Q: Is this component programmable via standard parallel interface?
A: Yes, it uses a parallel memory interface (x8/x16), supporting straightforward integration with MCUs and FPGAs.