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MT29F256G08CJABBWP-12IT:B
+StücklisteIC FLASH 256GBIT PAR 48TSOP I
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HerstellerMicron Technology Inc.
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Herstellerteil #MT29F256G08CJABBWP-12IT:B
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Paket TFSOP-48
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Auf Lager7428
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Part Status | Obsolete |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (MLC) |
| Memory Size | 256Gb (32G x 8) |
| Memory Interface | Parallel |
| Clock Frequency | 83 MHz |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
Übersicht
Description
This particular model is built with a high degree of reliability and performance, with an asynchronous interface for communication. The "-12IT" designation indicates its operating temperature range, making it suitable for industrial applications. The chip is commonly used in SSDs and embedded storage solutions due to its efficiency and durability.
Key features include fast read and write speeds, a compact form factor, and low power consumption, which are critical for mobile and constrained environments. Additionally, it supports advanced error correction and wear-leveling algorithms to enhance data integrity and lifespan. Overall, the MT29F256G08CJABBWP-12IT:B offers a robust solution for high-capacity storage needs.
Equivalent
Features
Key features include a high-speed interface that supports asynchronous and synchronous data transfer modes, enhancing data access and write performance. It also incorporates error correction code (ECC) to improve data integrity and reliability. The device's endurance and retention characteristics are designed to withstand multiple program/erase cycles, making it durable for long-term use.
Additionally, the MT29F256G08CJABBWP-12IT:B is packaged in a 63-ball BGA form factor, which is compact and allows for efficient use of space on printed circuit boards. Its design and specifications make it ideal for use in embedded systems, consumer electronics, and other applications requiring reliable and high-capacity flash storage.
Pinout
1. Power and Ground Pins: These provide the necessary power supply and ground connections to the chip.
2. Data I/O Pins: The chip has multiple data input/output pins, usually 8 (D0-D7), which facilitate data transfer.
3. Control Pins: These include pins like Chip Enable (CE#), Write Enable (WE#), Read Enable (RE#), and Command Latch Enable (CLE) that control the read/write operations.
4. Address and Command Latch Pins: Used to latch address and command inputs.
5. Ready/Busy Output (R/B#): This pin indicates the status of the device operations.
6. Write Protect (WP#): Used to protect the memory from accidental writes.
This chip is used in various applications requiring high-density storage solutions, like solid-state drives and embedded systems. Always refer to the specific datasheet for detailed pin configuration and functions.