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MT29F2G16ABBEAHC-AIT:E TR
+StücklisteNAND Flash SLC 2G 128MX16 FBGA
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HerstellerMicron
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Herstellerteil #MT29F2G16ABBEAHC-AIT:E TR
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Datenblatt MT29F2G16ABBEAHC-AIT:E TR DataSheet
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Auf Lager18175
365 Tage Qualitätsgarantie
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Spezifikationen
| Attribut | Wert |
| Packaging | MouseReel |
| StandardPackQty | 1000 |
Übersicht
Description
- Interface: 16-bit asynchronous
- Density: 2Gb (organized as 2048Mb)
- Voltage: 3.3V operation
- Speed: High-performance access
- Package: 48-pin TSOP (AIT suffix indicates industrial temp. range, -40°C to +85°C)
- TR suffix: Tape & Reel packaging for automated assembly
Designed for embedded systems, industrial, and consumer applications, it offers reliable storage with SLC (Single-Level Cell) or MLC (Multi-Level Cell) technology (check datasheet for specifics).
For detailed specs, refer to Micron’s official datasheet.
Equivalent
- K9F2G16U0A-PIB0 (Samsung)
- HY27UF082G2B (SK Hynix)
- TC58NVG1S3HTA00 (Toshiba/Kioxia)
- W29N02GVSIAA (Winbond)
These are 2Gb (256MB) SLC NAND Flash chips with a 16-bit bus, similar voltage (3.3V), and comparable speed. Verify pinout and timing for exact compatibility.
Features
- Interface: 16-bit parallel (asynchronous)
- Density: 2Gb (organized as 2048Mb)
- Voltage: 3.3V (Vcc)
- Speed: 25ns (tRC/tWC)
- Page Size: 2KB + 64B spare
- Block Size: 128KB (64 pages per block)
- Endurance: 100K program/erase cycles (typical)
- Operating Temp.: -40°C to +85°C (industrial-grade)
- Package: 48-pin TSOP (standard)
- ECC Support: 1-bit per 528 bytes (internal)
- Additional Features: On-die ECC, advanced bad block management
Ideal for embedded systems, industrial, and automotive applications requiring reliable, high-density storage.
Pinout
- Pin Count: 48 pins (TSOP-48 package)
- Interface: 16-bit parallel I/O (supports asynchronous and toggle modes)
- Voltage: 3.3V (Vcc)
- Density: 2Gb (256MB) organized as 2048 blocks, 64 pages per block, and 2112 bytes per page (2048 + 64 spare)
- Speed: Up to 50MHz in toggle mode
- Features: On-die ECC, program/erase suspend, and industrial temperature range (-40°C to +85°C)
This chip is commonly used in embedded storage applications like SSDs, industrial devices, and consumer electronics.