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MT29F4G08ABBDAHC-IT:D
+StücklisteIC FLASH 4GBIT PARALLEL 63VFBGA
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HerstellerMicron Technology Inc.
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Herstellerteil #MT29F4G08ABBDAHC-IT:D
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Auf Lager3469
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Spezifikationen
| Attribut | Wert |
| Part Status | Last Time Buy |
| Base Product Number | MT29F4G08 |
| Digi Key Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 4Gbit |
| Memory Organization | 512M x 8 |
| Memory Interface | Parallel |
| Voltage - Supply | 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 63-VFBGA |
| Supplier Device Package | 63-VFBGA (10.5x13) |
| Packaging | Tray |
Übersicht
Description
The chip features a single-level cell (SLC) architecture, which provides higher endurance and reliability compared to multi-level cell (MLC) or triple-level cell (TLC) memory. SLC NAND flash is often used in applications requiring frequent data writes and reads due to its robust performance and longer lifespan.
The MT29F4G08ABBDAHC-IT:D operates at a temperature range of -40°C to +85°C, making it suitable for industrial applications. It utilizes a parallel interface with an 8-bit bus width and supports standard NAND flash commands. The chip is packaged in a TSOP (Thin Small Outline Package) type, which facilitates easy integration into existing circuit designs. Overall, this NAND flash memory chip offers a balance of performance, reliability, and durability for various data storage needs.
Equivalent
Features
The memory is organized in a x8 I/O configuration, which facilitates efficient data transfer. It supports a wide operating temperature range of -40°C to +85°C, making it suitable for industrial applications. The device is compliant with the ONFI 1.0 (Open NAND Flash Interface) standard, ensuring interoperability with a variety of NAND controllers.
Additional features include a built-in ECC (Error Correction Code) support to enhance data integrity, and wear-leveling algorithms to prolong the device's lifespan. The MT29F4G08ABBDAHC-IT:D is typically used in applications such as embedded systems, automotive, and consumer electronics where reliable data storage is crucial.
Pinout
The key functions and pin assignments include:
- I/O Pins (I/O0-I/O7): Data input/output.
- CLE (Command Latch Enable): Activates command register.
- ALE (Address Latch Enable): Activates address register.
- CE# (Chip Enable): Activates the memory device.
- WE# (Write Enable): Allows writing to the memory.
- RE# (Read Enable): Allows reading from the memory.
- WP# (Write Protect): Protects against inadvertent writes.
- R/B# (Ready/Busy): Indicates the status of the chip.
- VCC: Power supply.
- VSS: Ground.
These functions provide essential operations for interfacing with the NAND Flash, including data reading, writing, and management. The specific configuration and use will depend on the application and system design.
Manufacturer
Application
1. Consumer Electronics: Such as smartphones, tablets, and digital cameras, where it provides storage for operating systems, applications, and user data.
2. Industrial Equipment: Used in devices that require robust data storage under various environmental conditions, like automation systems and data loggers.
3. Automotive Systems: Employed in infotainment systems, navigation systems, and other in-car electronic systems that require non-volatile storage.
4. Networking Devices: Utilized in routers and switches for firmware storage and configuration data.
5. Embedded Systems: Provides storage for embedded applications across various industries.
Package
Frequently Asked Questions
Q: What is the memory density and organization of this NAND Flash?
A: This device has a 4Gbit density organized as 512M x 8 bits, suitable for high-density storage applications.
Q: What is the operating voltage range for this component?
A: It operates from 1.7V to 1.95V, ideal for low-power and portable electronic designs.
Q: Is this component suitable for industrial temperature ranges?
A: Yes, it supports -40°C to 85°C ambient temperature, making it reliable for harsh environments.
Q: What type of memory interface does this part use?
A: It uses a Parallel memory interface, standard for legacy NAND Flash controller designs.
Q: Which package is this NAND Flash available in?
A: It is supplied in a 63-VFBGA (10.5x13) surface mount package, ideal for compact PCB layouts.
Q: Is this component still in active production or end-of-life?
A: Its part status is "Last Time Buy", indicating final purchasing opportunity before discontinuation.