MT29F8G16ABACAWP-IT:C

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MT29F8G16ABACAWP-IT:C

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IC FLASH 8GBIT PARALLEL 48TSOP I

  • HerstellerMicron Technology Inc.

  • Herstellerteil #MT29F8G16ABACAWP-IT:C

  • Paket TFSOP-48

  • Auf Lager7831

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Spezifikationen

Attribut Wert
Package / Case Tray
Part Status Obsolete
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND
Memory Size 8Gb (512M x 16)
Memory Interface Parallel
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount

Übersicht

Description

MT29F8G16ABACAWP-IT:C is Micron’s 8‑Gbit NAND flash memory device (MT29F8G16 series), offered in an industrial-temperature variant. It is a high-density, x16 (16‑bit) parallel NAND with MLC storage, suitable for embedded storage and SSDs in harsh environments. It uses an ONFI‑type parallel interface and requires a NAND controller with ECC and wear leveling. The exact page size, block architecture, voltage, and timing are detailed in the Micron datasheet.

Equivalent

MT29F8G16ABACAWP-IT:C is Micron’s 8‑Gbit, x16 NAND Flash. There is no single public drop‑in equivalent; cross‑references depend on die revision, package, voltage and ECC. To find substitutes, use Micron’s Cross Reference tool or distributor cross‑reference, and match: 8Gbit capacity, x16 I/O, 2KB page, ONFI 3.x, and compatible voltage. Other vendors offer 8Gbit x16 families (Samsung, Hynix); verify with the cross‑reference.

Features

Key features of MT29F8G16ABACAWP-IT:C (Micron NAND Flash):
- 8 Gbit density, x16 data width (16-bit wide NAND)
- MLC (multi-level cell) NAND Flash
- ONFI-compliant interface
- Multi-plane and multi-die capability for parallelism
- Page-based organization with spare area
- Built-in ECC support, wear leveling and bad-block management
- Voltages: typical 1.8V core, 3.3V I/O
- Low power modes and deep power-down
- Industrial temperature grade (IT) variant for broader operating ranges
Note: Exact page size, spare area, endurance, and packaging details are specified in the official datasheet; please consult it for precise numbers.

Pinout

- Pin count: 48 pins (TSOP-48 package).
- Function: Micron MT29F8G16ABACAWP-IT:C is a NAND Flash memory device (8 Gbit) with an 8-bit I/O data bus (IO0–IO7) and a command/address interface. External pins include CLE (command latch enable), ALE (address latch enable), CE#, WE#, RE#, WP#, R/B# (ready/busy), Vcc, Vccq, GND, and NC (no connect) pins. Data/addresses are sent on the I/O pins with CLE/ALE controlling command and address latching; R/B indicates readiness.

Manufacturer

- Manufacturer: Micron Technology, Inc.
- What kind of company: An American multinational semiconductor company that designs, manufactures, and sells memory and storage technologies (DRAM, NAND/NOR flash, SSDs, etc.). It is one of the world’s largest memory makers.

Application

MT29F8G16ABACAWP-IT:C is a high-density NAND flash (8Gbit, x16). Typical application areas include:
- Embedded systems requiring dense 16-bit NAND
- Primary storage/firmware in consumer electronics (digital cameras, camcorders, USB drives, memory cards)
- Embedded/standalone SSDs and eMMC-style storage
- Industrial/Automotive environments (industrial temperature grade, -IT) for reliability in harsh conditions
- Networking gear, set-top boxes, printers and other devices needing robust, dense flash storage

Package

FBGA (96‑ball) package. The MT29F8G16ABACAWP-IT:C is Micron’s NAND Flash in a 96‑pin FBGA package (industrial-temp variant -IT).

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