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MT29F8G16ADBDAH4-IT:D
+StücklisteIC FLASH 8GBIT PARALLEL 63VFBGA
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HerstellerMicron Technology Inc.
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Herstellerteil #MT29F8G16ADBDAH4-IT:D
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Paket VFBGA-63
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Auf Lager6566
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Bulk |
| Part Status | Obsolete |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 8Gb (512M x 16) |
| Memory Interface | Parallel |
| Voltage - Supply | 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
Übersicht
Description
Key features of the MT29F8G16ADBDAH4-IT:D include its 8-gigabit capacity arranged in a 16-bit I/O interface, which allows for efficient data transfers. The chip is designed with advanced error correction capabilities to ensure data integrity, making it suitable for use in demanding environments. It operates over an industrial temperature range, which enhances its applicability in various industrial and automotive applications.
The NAND architecture of the MT29F8G16ADBDAH4-IT:D facilitates high-speed programming and erasing, making it a popular choice for embedded systems, consumer electronics, and mobile devices requiring reliable and fast storage solutions. Its design also supports wear-leveling algorithms, extending the lifespan of the memory by evenly distributing write and erase cycles across the memory cells.
Equivalent
Features
Key features include:
1. Density and Capacity: Offers 8 gigabits of storage capacity.
2. Performance: Provides fast read and write speeds, typical of SLC NAND technology.
3. Reliability: High endurance and data retention, ideal for robust applications.
4. Temperature Range: Operates over a wide industrial temperature range, typically -40°C to 85°C.
5. Interface: Utilizes a standard NAND interface for easy integration into designs.
6. Package Type: Available in a 48-pin TSOP package, facilitating compatibility with various circuit boards.
Overall, its robust performance and reliability make it suitable for demanding environments where data integrity and longevity are critical.
Pinout
The pin configuration includes inputs for command, address, and data, as well as control signals for managing read, write, and erase operations. Key pins include:
- I/O Pins (I/O0 - I/O15): These are used for data input/output.
- CLE (Command Latch Enable): Used to latch commands into the internal command register.
- ALE (Address Latch Enable): Used to latch addresses into the internal address register.
- CE# (Chip Enable): Activates the chip when low.
- RE# (Read Enable): Controls data output during a read operation.
- WE# (Write Enable): Controls data input during a write operation.
- WP# (Write Protect): Protects the memory from accidental writes.
- R/B# (Ready/Busy): Indicates the status of the device.
The remaining pins are used for power connection and other control signals. This device is suitable for a range of applications, including solid-state drives, mobile devices, and other embedded systems.