Abbildungen dienen nur als Referenz
MT40A256M16GE-083E:B
+StücklisteIC DRAM 4GBIT PAR 1.2GHZ 96FBGA
-
HerstellerMicron Technology Inc.
-
Herstellerteil #MT40A256M16GE-083E:B
-
Auf Lager2175
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| PartStatus | Obsolete |
| BaseProductNumber | MT40A256M16 |
| DigiKeyProgrammable | Not Verified |
| MemoryType | Volatile |
| MemoryFormat | DRAM |
| Technology | SDRAM - DDR4 |
| MemorySize | 4Gbit |
| MemoryOrganization | 256M x 16 |
| MemoryInterface | Parallel |
| ClockFrequency | 1.2 GHz |
| Voltage-Supply | 1.14V ~ 1.26V |
| OperatingTemperature | 0°C ~ 95°C (TC) |
| MountingType | Surface Mount |
| Package | 96-TFBGA |
| SupplierDevicePackage | 96-FBGA (9x14) |
| Packaging | Tray |
Übersicht
Description
Key features of the MT40A256M16GE-083E:B include a data rate of 2400 MT/s (megatransfers per second), which supports faster data access and improved performance in high-demand environments. It operates at a low voltage of 1.2V, contributing to energy efficiency and reduced power consumption, which is beneficial for both mobile and stationary devices.
The chip is designed with advanced error-correcting code (ECC) capabilities that ensure data integrity by detecting and correcting single-bit errors. It's suitable for a range of applications, including servers, desktops, and other computing devices that require reliable and efficient memory solutions. Its compact design and robust performance make it a versatile choice for improving system performance and reliability.
Equivalent
1. Samsung: K4A8G165WC-BCTD
2. SK Hynix: H5AN8G8NAFR-TJC
3. Kingston: D5128A1PBJ-DRD
These alternatives share comparable speed, capacity, and form factor, making them suitable replacements in applications requiring DDR4 memory. Always verify compatibility with your specific device.
Features
Key features include:
1. Voltage: Operates at 1.2V, which is standard for DDR4 and helps in reducing power consumption.
2. Form Factor: Offered in a compact FBGA (Fine-pitch Ball Grid Array) package, suitable for space-constrained applications.
3. Data Bus Width: 16 bits, suitable for high-bandwidth applications.
4. Temperature Range: Designed for standard operating temperatures, typically between 0°C to 85°C.
5. ECC Support: May include Error-Correcting Code (ECC) for improved reliability, though specific configurations may vary.
These features make it suitable for use in a variety of computing environments, including personal computers, servers, and embedded systems, where efficient performance and energy management are crucial.
Pinout
The primary functions of this chip include:
1. Data Storage and Access: It stores data for quick access by the CPU and other processing units.
2. High-Speed Operation: Supports high-speed data transfer rates typical of DDR4 memory.
3. Low Power Consumption: Utilizes features like deep power-down modes to save energy.
4. Error Correction: Supports error-correction features to ensure data integrity.
5. Bank Management: Organized into multiple banks for efficient data management and retrieval.
These features make it suitable for use in various applications requiring fast and efficient memory solutions, such as computing, telecommunications, and consumer electronics.
Manufacturer
Application
Package
Frequently Asked Questions
Q: Is this DDR4 memory compatible with standard 1.2V supply systems?
A: Yes, it operates within a 1.14V to 1.26V supply range, making it compatible with standard 1.2V DDR4 memory power rails.
Q: What is the maximum data transfer rate supported by the 1.2 GHz clock?
A: The 1.2 GHz clock frequency corresponds to a DDR4-2400 data rate, achieving 2400 MT/s per pin via double data rate transfer.
Q: Can this component handle high-temperature industrial environments?
A: With an operating temperature range of 0°C to 95°C (TC), it is suited for commercial and extended temperature applications, but not harsh industrial conditions.
Q: What is the exact physical footprint of this BGA package?
A: It uses a 96-ball TFBGA package in a 9x14 mm body, ideal for space-constrained surface-mount designs requiring high density.
Q: How is the 4Gbit memory organized internally?
A: The memory is organized as 256M words by 16 bits, providing a 16-bit wide parallel data interface for efficient data throughput.
Q: Is this device programmable via DigiKey or does it require pre-configuration?
A: It is marked as "Not Verified" for DigiKey programmability, meaning it ships as a standard fixed-function DDR4 SDRAM without field customization.
Q: What is the recommended mounting and soldering process for this FBGA?
A: It is designed for surface mount technology (SMT) using standard reflow soldering profiles for 96-ball FBGA packages.