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1Gbit 1.425V~1.575V 667MHz DDR3 SDRAM 96-FBGA (8x14) Memory (ICs) RoHS
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HerstellerMicron
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Herstellerteil #MT41J64M16JT-15E IT:G
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Auf Lager7061
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Spezifikationen
| Attribut | Wert |
| Packaging | 96-FBGA (8x14) |
| Clock Frequency | 667MHz |
| Memory Format | DDR3 SDRAM |
| Memory Size | 1Gbit |
| Operating Temperature | -40℃~+95℃ |
| Voltage - Supply | 1.425V~1.575V |
Übersicht
Description
Key features of the MT41J64M16JT-15E IT:G include a memory density of 1Gb (gigabit), an organization of 64 Meg x 16-bit, and a speed rating of 667 MHz (megahertz), which translates to a data rate of 1333 MT/s (megatransfers per second). It operates at a standard voltage of 1.5V and is packaged in a 96-Ball FBGA (Fine-Pitch Ball Grid Array), which provides a compact and efficient form factor for integration into various systems.
Additionally, this DRAM chip offers features like self-refresh, low-power auto self-refresh, and thermal sensor options, making it suitable for use in temperature-sensitive environments.
Equivalent
1. Hynix: H5TQ1G63EFR-PBC
2. Samsung: K4B1G1646G-BCK0
3. Nanya: NT5CB64M16DP-CG
4. Elpida/Micron: EDJ2116BASE-GN-F
These chips offer similar specifications like capacity, speed, and voltage, suitable for similar applications. Always verify compatibility with your specific system requirements before substituting.
Features
1. Capacity: It has a memory capacity of 1Gb (gigabit), organized as 64M x 16 bits.
2. Speed: The component operates at a speed of 667 MHz with a data rate of 1333 MT/s (megatransfers per second).
3. Voltage: It typically operates at a voltage of 1.5V.
4. Temperature Range: The IT in its model name indicates that it is rated for industrial temperature ranges, typically -40°C to +95°C, suitable for industrial applications.
5. Package: It comes in a standard 96-ball BGA (Ball Grid Array) package.
6. Features: Supports automatic refresh and self-refresh modes, along with a power-saving mode to reduce energy consumption.
7. Compatibility: Designed for use in various applications, including computing, networking, and telecommunications.
These features make it suitable for high-performance and industrial applications where reliability and speed are critical.
Pinout
The chip is housed in a 96-ball FBGA (Fine-Pitch Ball Grid Array) package. This package configuration includes various pins (or balls) that serve distinct functions. These functions typically include:
1. Power and Ground Pins: VDD, VSS for core power and ground.
2. Data Pins: DQ[0:15] for data input/output.
3. Address Pins: A[0:14] for addressing specific memory locations.
4. Bank Address Pins: BA[0:2] to select one of the 8 banks.
5. Control Pins: Such as CS# (Chip Select), RAS#, CAS#, WE# for command inputs.
6. Clock Pins: CK, CK# for clock input.
7. Data Strobe Pins: DQS, DQS# for data signal timing.
8. Other Pins: CKE (Clock Enable), ODT (On-Die Termination).
For precise pin details and functions, refer to the official datasheet provided by Micron.