Abbildungen dienen nur als Referenz
MT46H64M16LFBF-5IT:B
+Stückliste-
HerstellerJLCPCB-Baugruppe
-
Herstellerteil #MT46H64M16LFBF-5IT:B
-
Auf Lager4542
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Manufacturer | JLCPCB Assembly |
| Package | BGA-60 |
Übersicht
Description
Key features include a standard operating voltage of 1.5V, support for various data rates, and a high degree of reliability suitable for various applications, including consumer electronics, automotive systems, and industrial devices. It uses a 78-ball FBGA (Fine Ball Grid Array) package, allowing for compact design in electronic systems. This chip is commonly used in memory modules and embedded applications where performance and power efficiency are crucial.
Equivalent
Features
1. Capacity: 1GB (64M x 16 bits).
2. Memory Type: DDR3 SDRAM, which offers higher speed and efficiency compared to DDR2.
3. Speed Grade: Operates at a data rate of 800 MT/s (Mega Transfers per second).
4. Voltage: Powered by a low voltage of 1.5V, enhancing energy efficiency.
5. Organization: Contains 8 banks, allowing for improved performance in multitasking environments.
6. Package Type: Available in a FBGA (Fine Ball Grid Array) package, which supports high-density applications.
7. Operating Temperature: Commercial temperature range (0°C to 70°C), suitable for consumer electronics.
This memory chip is often used in various applications, including laptops, desktops, and other electronic devices requiring reliable and fast memory performance.
Pinout
The main functions of this chip include providing high-speed memory access for applications like computers and networking devices. The pins are used for various functions, including data input/output (DQ), address input (A), control signals (like CS, RAS, CAS, and WE), power, and ground connections. The chip is designed for performance and efficiency, supporting features like burst mode and programmable operation for enhanced data transfer rates.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What is the memory density and organization of the MT46H64M16LFBF-5IT:B?
A: It is a 1Gb (gigabit) DDR SDRAM organized as 64 Meg x 16 bits, suitable for high-bandwidth applications.
Q: What does the "-5IT" speed grade indicate for this component?
A: It indicates a maximum clock frequency of 200 MHz (data rate of 400 Mbps per pin), with "I" denoting an industrial temperature range and "T" for lead-free/tin finish.
Q: What is the typical operating voltage for this BGA-60 memory chip?
A: It operates at a standard 2.5V core voltage (VDD) and 2.5V I/O voltage (VDDQ), with VDDQ typically matching VDD.
Q: Can this component be used in low-power or mobile applications?
A: Yes, it belongs to the Mobile DDR (LPDDR) family, optimized for power efficiency in portable and embedded systems.
Q: What is the standard operating temperature range for the industrial variant?
A: The industrial ("I") temperature range is -40°C to +85°C, ensuring reliable operation in harsh environments.
Q: What package size does the BGA-60 refer to?
A: BGA-60 is a 60-ball Fine-Pitch Ball Grid Array, typically 8mm x 9mm or 10mm x 10.5mm, depending on the specific layout.