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MT48LC16M16A2P-7E IT:G
+Stückliste256Mbit 3V~3.6V 133MHz TSOPII-54-10.2mm Memory (ICs) RoHS
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HerstellerMicron
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Herstellerteil #MT48LC16M16A2P-7E IT:G
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Auf Lager4466
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Packaging | TSOPII-54-10.2mm |
| Clock Frequency | 133MHz |
| Memory Size | 256Mbit |
| Operating Temperature | -40℃~+85℃ |
| Voltage - Supply | 3V~3.6V |
Übersicht
Description
The "7E" in its designation indicates the speed grade, with a cycle time of 7 nanoseconds, allowing for fast access times. The "IT" denotes the Industrial Temperature range, meaning it can operate in temperatures from -40°C to 85°C, making it suitable for industrial applications. The "G" typically refers to the RoHS compliance, indicating it is a lead-free component.
Its design includes features such as auto-refresh, self-refresh, and programmable mode registers, enhancing its versatility and reliability in various applications. Overall, the MT48LC16M16A2P-7E IT:G is a robust choice for systems requiring reliable memory performance under challenging conditions.
Equivalent
1. Samsung K4S281632I-TC: 256Mb SDRAM with similar timings and configuration.
2. Hynix HY57V561620FTP-7: 256Mb SDRAM with compatible specifications.
3. Winbond W9825G6JH-6: Another 256Mb SDRAM option with similar features.
These alternatives should be cross-verified for specific application requirements, including operating conditions and pin compatibility.
Features
1. Type: It's a 256Mb (megabit) SDRAM (Synchronous Dynamic Random Access Memory) organized as 16Mb x 16.
2. Speed: The chip operates with a clock frequency of up to 143 MHz, with a cycle time of 7 ns.
3. Voltage: It supports a power supply voltage range of 2.7V to 3.6V.
4. Package: Available in a 54-pin TSOP II package, designed for surface mounting.
5. Temperature Range: The "IT" designation indicates it is rated for an industrial temperature range from -40°C to +85°C.
6. Features: Includes auto-refresh and self-refresh modes, along with burst read/write capabilities. It supports a CAS latency of 2 or 3, providing flexibility for different performance needs.
7. Compatibility: Conforms to JEDEC standards, ensuring compatibility with other SDRAM devices.
These features make it suitable for various applications requiring reliable memory performance, such as embedded systems and industrial electronics.
Pinout
The key functions of its pins include:
1. Data Pins (DQ0-DQ15): These 16 pins are used for data input and output.
2. Address Pins (A0-A12): These pins are used to specify memory addresses for read and write operations.
3. Bank Address Pins (BA0-BA1): These are used to select one of the four memory banks.
4. Control Pins: Such as Clock (CLK), Clock Enable (CKE), Chip Select (CS#), Row Address Strobe (RAS#), Column Address Strobe (CAS#), and Write Enable (WE#).
5. Other Pins: Including Power Supply (VDD, VSS) and reference voltage (VREF).
This configuration supports functionalities like burst read/write, auto-refresh, and high-speed data transfers, critical for applications requiring fast and reliable memory access.
Manufacturer
Application
1. Consumer Electronics: Utilized in devices like digital cameras, camcorders, and gaming consoles.
2. Telecommunications: Supports infrastructure equipment such as routers and switches.
3. Automotive Systems: Used in applications that require stable memory under different temperature ranges.
4. Industrial Equipment: Employed in control systems and automation devices.
5. Networking Equipment: Helps in data buffering and processing in network hardware.
These applications benefit from the chip's low power consumption and high-speed operation capabilities.