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8Gbit 1.1V 1.866GHz LPDDR4 SDRAM WFBGA-200 Memory (ICs) RoHS
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HerstellerMicron
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Herstellerteil #MT53E256M32D2DS-053 AAT:B
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Auf Lager25563
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Packaging | WFBGA-200 |
| Clock Frequency | 1.866GHz |
| Supply Current | 40mA |
| Memory Format | LPDDR4 SDRAM |
| Memory Size | 8Gbit |
| Operating Temperature | -40℃~+105℃ |
| Refresh Current | 2mA |
| Voltage - Supply | 1.1V |
Übersicht
Description
Key features of the MT53E256M32D2DS-053 AAT:B include high data transfer rates, improved energy efficiency compared to previous DRAM generations, and a compact form factor suitable for modern electronic devices. It supports a wide range of operational frequencies and is capable of delivering fast access times, which is critical for applications that require quick data retrieval and processing. The chip is built using advanced semiconductor process technology, ensuring reliability and robustness for consumer and industrial applications.
Overall, the MT53E256M32D2DS-053 AAT:B is a versatile memory solution that caters to the needs of high-performance, energy-efficient devices in the tech industry.
Equivalent
Features
1. Low Power Consumption: Designed for mobile and embedded applications, it offers reduced power usage, enhancing battery life in portable devices.
2. High-Speed Data Transfer: Supports data rates of up to 4266 MT/s, allowing for efficient handling of high-bandwidth tasks.
3. Die Density: Provides a density of 8Gb (gigabits) per die, catering to applications requiring substantial memory capacity.
4. Package Type: Available in a compact package suitable for space-constrained applications.
5. Voltage: Operates at low voltages, typically around 1.1V, reducing power requirements.
6. Advanced Features: Includes support for features such as Deep Power Down (DPD) mode and Partial Array Self Refresh (PASR) to further minimize power usage during inactive periods.
7. Reliability and Performance: Incorporates error-correcting code (ECC) for improved data integrity and reliability.
This memory module is ideal for smartphones, tablets, and other devices where power efficiency and performance are critical.
Pinout
With 256 Megabits organized as 32M x 32, this LPDDR4X memory chip supports features such as deep power down, clock stop power down, and command-based power-down modes for energy efficiency. Additionally, it supports high-speed data transfer rates thanks to its dual-channel operation, along with features like on-die termination (ODT) and programmable drive strengths to optimize signal integrity. This makes it suitable for mobile devices, tablets, and other portable electronics that demand efficient power management and high performance.