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MT53E2G32D4DE-046 WT:C
+StücklisteDRAM LPDDR4 64Gbit 32 200/264 TFBGA 4 WT
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HerstellerMicron
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Herstellerteil #MT53E2G32D4DE-046 WT:C
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Auf Lager9319
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Spezifikationen
| Attribut | Wert |
| Packaging | Tray |
| Standard Pack Qty | 1360 |
Übersicht
Description
The "WT" label typically indicates a specific product feature or specification related to thermal properties or testing procedures. The "C" suffix may denote a particular packaging type, revision, or customer-specific version.
Overall, the MT53E2G32D4DE-046 WT:C is engineered to provide enhanced data transfer rates, improved bandwidth, and reduced power consumption compared to previous generations, making it suitable for applications requiring reliable and fast memory performance. It supports a range of DDR4 features, including error correction, on-die termination, and other advanced technologies that enable robust and scalable memory solutions.
Equivalent
Features
1. Memory Type: This is a LPDDR4 (Low Power Double Data Rate 4) DRAM, designed for high efficiency and performance in mobile and embedded systems.
2. Capacity: It has a capacity of 8Gb (gigabits), organized in 2 ranks.
3. Data Rate: The component supports high data rates, reaching up to 4266 MT/s (Mega Transfers per second), facilitating fast data processing.
4. Voltage: Operates at a low voltage of 1.1V, which helps in reducing power consumption, making it ideal for battery-powered devices.
5. I/O Width: Features a 32-bit I/O data width, allowing for efficient data throughput.
6. Package: Typically available in a compact BGA (Ball Grid Array) package, which is suitable for space-constrained applications.
7. Temperature Range: Designed to operate in a wide temperature range, supporting both industrial and consumer-grade applications.
These features make it suitable for use in smartphones, tablets, and various IoT devices, where power efficiency and high performance are crucial.
Pinout
As for the pin count, the MT53E2G32D4DE package typically comes with 200 balls in a Fine-Pitch Ball Grid Array (FBGA) package. This configuration is standard for many LPDDR4 DRAM chips, allowing for efficient communication with the processor in a compact form factor.
The primary functions of the pins/balls include:
1. Data I/O (DQ): Handles data transfer to and from the memory.
2. Address/Command (CA): Used for sending commands and addressing information.
3. Clock (CK/CK#): Provides the clock signal for synchronizing the operations.
4. Power (VDD/VDDQ): Supplies power to the core and I/O.
5. Ground (VSS/VSSQ): Provides ground reference for core and I/O.
6. Other Control Signals: Includes signals like Chip Select (CS#), Reset (RESET#), and others for managing operations.
This configuration ensures high-speed data processing while maintaining low power consumption.