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MTFC4GACAAAM-1M
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HerstellerMicron Tech
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Herstellerteil #MTFC4GACAAAM-1M
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Auf Lager16772
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Spezifikationen
| Attribut | Wert |
| Manufacturer | Micron Tech |
| Package | VFBGA-153 |
Übersicht
Equivalent
The MTFC4GACAAAM-1M is a 4GB eMMC chip from Micron. Equivalent products include:
- Samsung KLM4G1FEPD-B031 (4GB eMMC 5.1)
- Kioxia THGBM4G4D1HBAIR (4GB eMMC)
- SK Hynix H26M41103HPR (4GB eMMC 5.0)
- SanDisk SDINBDG4-4G (4GB eMMC)
Ensure compatibility with pinout, voltage, and interface (eMMC 5.0/5.1). Check datasheets for exact matches.
- Samsung KLM4G1FEPD-B031 (4GB eMMC 5.1)
- Kioxia THGBM4G4D1HBAIR (4GB eMMC)
- SK Hynix H26M41103HPR (4GB eMMC 5.0)
- SanDisk SDINBDG4-4G (4GB eMMC)
Ensure compatibility with pinout, voltage, and interface (eMMC 5.0/5.1). Check datasheets for exact matches.
Features
The MTFC4GACAAAM-1M is a 32GB eMMC 5.1 flash storage module by Micron. Key features:
- Capacity: 32GB (4GB x 8 dies)
- Interface: eMMC 5.1 (backward-compatible)
- Performance: Up to 250MB/s sequential read, 125MB/s sequential write
- Endurance: 3,000 P/E cycles (typical)
- Operating Temp.: -25°C to +85°C (industrial-grade)
- Form Factor: BGA-153 (11.5mm x 13mm)
- Features: TRIM, SMART, wear-leveling, and bad block management
Ideal for embedded systems, IoT, and industrial applications.
- Capacity: 32GB (4GB x 8 dies)
- Interface: eMMC 5.1 (backward-compatible)
- Performance: Up to 250MB/s sequential read, 125MB/s sequential write
- Endurance: 3,000 P/E cycles (typical)
- Operating Temp.: -25°C to +85°C (industrial-grade)
- Form Factor: BGA-153 (11.5mm x 13mm)
- Features: TRIM, SMART, wear-leveling, and bad block management
Ideal for embedded systems, IoT, and industrial applications.
Pinout
The MTFC4GACAAAM-1M is a 4GB eMMC 5.1 flash memory chip from Micron.
- Pin Count: 153-ball BGA (Ball Grid Array).
- Functions:
- Storage: 4GB NAND flash for data storage.
- Interface: eMMC 5.1 (backward-compatible with earlier versions).
- Controller: Integrated flash controller for simplified host communication.
- Power Supply: Operates at 3.3V (VCC) and 1.8V/3.3V (VCCQ).
- Data Transfer: Supports up to 400MB/s (HS400 mode).
Commonly used in embedded systems, IoT devices, and mobile applications.
- Pin Count: 153-ball BGA (Ball Grid Array).
- Functions:
- Storage: 4GB NAND flash for data storage.
- Interface: eMMC 5.1 (backward-compatible with earlier versions).
- Controller: Integrated flash controller for simplified host communication.
- Power Supply: Operates at 3.3V (VCC) and 1.8V/3.3V (VCCQ).
- Data Transfer: Supports up to 400MB/s (HS400 mode).
Commonly used in embedded systems, IoT devices, and mobile applications.
Package
The MTFC4GACAAAM-1M is a eMMC (embedded MultiMediaCard) storage device. It comes in a BGA (Ball Grid Array) package, which is standard for eMMC chips. This package type ensures compact integration into embedded systems, commonly used in smartphones, tablets, and IoT devices. The "1M" likely denotes a 1-million-unit reel packaging for high-volume manufacturing.
