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MX25L25645GZ2I-10G
+StücklisteIC FLASH 256MBIT SPI 8WSON
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HerstellerMakronix
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Herstellerteil #MX25L25645GZ2I-10G
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Spezifikationen
| Attribut | Wert |
| Series | MXSMIO™ |
| Part Status | Not For New Designs |
| Base Product Number | MX25L25645 |
| Digi Key Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 256Mbit |
| Memory Organization | 32M x 8 |
| Memory Interface | SPI |
| Clock Frequency | 120 MHz |
| Write Cycle Time - Word, Page | 30µs, 750µs |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 8-WDFN Exposed Pad |
| Supplier Device Package | 8-WSON (8x6) |
| Packaging | Tray |
Übersicht
Description
Key features include a standard SPI (Serial Peripheral Interface) for communication, with support for dual and quad I/O operations to enhance data transfer speeds. It offers fast read speeds and has a robust endurance for program/erase cycles, making it durable for frequent use. The memory is organized in uniform 4KB sectors and 64KB blocks, allowing for easy and flexible data management.
Additional features include low power consumption, making it energy-efficient, and integrated security measures like block protection and hardware-based write protection to safeguard data integrity. Overall, the MX25L25645GZ2I-10G is a versatile and reliable choice for embedded systems requiring high-speed and non-volatile memory solutions.
Equivalent
1. W25Q256JV – by Winbond
2. S25FL256S – by Cypress Semiconductor (Infineon)
3. MT25QL256ABA – by Micron Technology
4. AT25DF256 – by Adesto Technologies (Dialog Semiconductor/Renesas)
These alternatives offer similar storage capacities and SPI interfaces, making them suitable substitutes for the MX25L25645GZ2I-10G. Always verify pin configurations and specific features when considering replacements.
Features
Key features include a wide operating temperature range from -40°C to 85°C, making it suitable for industrial applications. It is organized into 65,536 sectors, each consisting of 4KB, and 512 blocks of 64KB each, with the capability to erase data in sectors, blocks, or the entire chip. The device supports secure operations with write protection features and can undergo up to 100,000 program/erase cycles. Its low-power consumption is ideal for battery-operated devices. The MX25L25645GZ2I-10G is housed in a compact package, optimizing space in PCB designs.
Pinout
Here is a brief overview of its pin functions:
1. CS# (Chip Select): Activates the device when low.
2. SO/SIO1: Serial Data Output or data line 1 in Dual/Quad modes.
3. WP# (Write Protect): Protects certain sectors from being modified.
4. GND: Ground reference.
5. SI/SIO0: Serial Data Input or data line 0 in Dual/Quad modes.
6. SCLK (Serial Clock): Clock input for synchronization.
7. HOLD#/SIO3: Pauses serial communication or acts as data line 3 in Quad modes.
8. VCC: Power supply input.
This chip supports features like fast read/write operations, low power consumption, and is often used in applications requiring reliable data storage, such as in consumer electronics, industrial systems, and computing devices.
Manufacturer
Application
Package
Frequently Asked Questions
Q: What is the memory size and organization of the MX25L25645GZ2I-10G?
A: It is a 256Mbit NOR Flash memory organized as 32M x 8 bits, ideal for code and data storage in embedded systems.
Q: What interface does this Flash memory support?
A: It supports the SPI (Serial Peripheral Interface) for communication, allowing high-speed data transfer with a clock frequency up to 120 MHz.
Q: What is the operating voltage range for this component?
A: The operating voltage range is 2.7V to 3.6V, suitable for standard 3.3V logic systems.
Q: What is the typical write cycle time for a page or word?
A: The write cycle time is 30µs per word and 750µs per page, ensuring efficient programming performance.
Q: What is the operating temperature range?
A: It operates over an industrial temperature range of -40°C to 85°C (TA), making it reliable in harsh environments.
Q: What package is available for this device?
A: It comes in an 8-WDFN exposed pad package, with a supplier device package of 8-WSON (8x6 mm), suitable for surface mount applications.
Q: Is this part recommended for new designs?
A: No, the status is "Not For New Designs"; it is intended for existing designs or legacy support.