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MX25L6473EM2I-10G
+StücklisteIC FLASH 64MBIT SPI 104MHZ 8SOP
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HerstellerMakronix
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Herstellerteil #MX25L6473EM2I-10G
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Spezifikationen
| Attribut | Wert |
| Series | MXSMIO™ |
| Part Status | Not For New Designs |
| Base Product Number | MX25L6473 |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 64Mbit |
| Memory Organization | 8M x 8 |
| Memory Interface | SPI |
| Clock Frequency | 104 MHz |
| Write Cycle Time - Word, Page | 50µs, 3ms |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package | 8-SOIC (0.209", 5.30mm Width) |
| Supplier Device Package | 8-SOP |
| Packaging | Tube |
Übersicht
Description
Key points:
- Capacity and organization: 64 Mbit (8 MB) of flash memory with sector/block erase (4 KB sectors, 64 KB blocks; chip erase supported).
- Interface: SPI-compatible with standard SPI and Quad I/O/dual I/O modes for higher bandwidth.
- Voltage and temp: typically 2.7–3.6 V operation; wide temperature options for industrial/embedded use.
- Performance: fast read up to high MHz (QSPI/dual-QUAD modes available); typical page program times in microseconds (dependent on mode and voltage).
- Features: sector protection and security features, deep power-down, wakeup, and usual read/write protection options.
- Applications: code storage, firmware updates, boot loaders in MCUs/SoCs.
Note: for exact timing, command set, endurance, and packaging details, consult the MX25L6473EM2I-10G datasheet and application notes.
Equivalent
- Winbond W25Q64JV/W25Q64FV
- GigaDevice GD25Q64C/B
- ISSI IS25LP064A
- Cypress/Spansion S25FL064K
- Macronix MX25L6433F / MX25L64F
Note: check exact package, voltage, and Quad/SPI mode support for true drop-in replacement.
Features
- 64 Mbit (8 M × 8) serial flash memory
- Interfaces: SPI with Dual I/O, Quad I/O, and QPI support
- High-speed: up to 104 MHz operation in Quad/QPI modes
- Memory organization: 256-byte page; Erase options of 4 KB sectors, 32 KB/64 KB blocks, plus chip erase
- Endurance/Retention: ~100,000 program/erase cycles; 20-year data retention
- Power: 2.7–3.6 V supply (I/O and core); low-power modes including Deep Power-Down
- Operating temperature: typically -40 to 85°C (industrial)
- Security: hardware write protection, block protection, and OTP/protected regions
- Additional: standard read/fast read commands, RDID/manufacture ID, suspend/resume for program/erase
- Packaging: 8-pin M2I package (RoHS-compliant)
Note: exact currents, speeds, and feature details can vary by device revision; consult the datasheet for precise numbers.
Pinout
- Function: 64‑Mbit serial flash memory with SPI/Quad I/O interface (DQ0–DQ3) for non-volatile storage; pins include VCC, GND, CS, CLK, and DQ0–DQ3.
Manufacturer
- What kind of company: A Taiwan-based semiconductor company that designs and manufactures non-volatile memory products, primarily flash memory and ROM, for consumer electronics, automotive, and embedded markets.
Application
- Boot memory and firmware storage for microcontrollers/SoCs
- Code and parameter storage for consumer electronics (set‑top boxes, printers, digital cameras, smart TVs)
- Firmware updates and data storage in network gear and industrial controllers
- External nonvolatile storage for IoT devices, wearables, sensors, and home automation
- Automotive applications (ECUs, infotainment) requiring reliable storage with suitable temperature ranges