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MX25U8033EBAI-12G
+StücklisteIC FLASH 8MBIT SPI/QUAD 8WLCSP
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HerstellerMakronix
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Herstellerteil #MX25U8033EBAI-12G
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Spezifikationen
| Attribut | Wert |
| Series | MXSMIO™ |
| Part Status | Active |
| Base Product Number | MX25U8033 |
| Digi Key Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 8Mbit |
| Memory Organization | 1M x 8 |
| Memory Interface | SPI - Quad I/O |
| Clock Frequency | 80 MHz |
| Write Cycle Time - Word, Page | 30µs, 3ms |
| Voltage - Supply | 1.65V ~ 2V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 8-XFBGA, WLCSP |
| Supplier Device Package | 8-WLCSP |
| Packaging | Cut Tape (CT), Tape & Reel (TR) |
Übersicht
Description
- Capacity: 8 Mbit (1 MB)
- Interface: SPI serial (with Quad I/O option)
- Voltage: typical 2.7–3.6 V operation
- Speed: fast read modes up to around 104 MHz in Quad I/O
- Organization: 4 KB sectors, 64 KB blocks; 256‑byte page program
- Features: Deep Power-Down, hold and write-protect controls, status/config registers, basic security options
- Package: 8-pin (EBAI) small-outline package
用途: firmware/code storage, configuration data, look-up tables in embedded systems.
Note: “12G” denotes a specific grade/packaging/revision per datasheet. For exact electrical timings, endurance, and voltage specs, consult the latest datasheet.
Equivalent
- Winbond W25Q80BV (also W25Q80DV)
- GigaDevice GD25Q80B
- ISSI IS25LP080D
Note: verify timing, voltage, hold, and sector/page layout for exact pin-for-pin compatibility.
Features
- Capacity: 8 Mbit (1 MB) serial NOR flash
- Interface: SPI with standard SPI, Dual I/O, and Quad I/O modes
- Supply voltage: 2.7–3.6 V (typical for MX25U family)
- Performance: Read up to 104 MHz (quad/dual I/O modes enable higher throughput)
- Memory organization: 256-byte pages; up to 256 bytes per page program
- Erase: 4 KB sectors; 64 KB blocks; entire array erase
- Endurance/Retention: ~100K P/E cycles; data retention typically 20 years
- Power management: Deep Power-Down mode for low current
- Security/protection: Write-enable/disable, sector protection, OTP area, 64‑bit unique ID
- Temperature range: Industrial (-40 °C to +85 °C)
- Package: 8-pin package (e.g., SOIC/USON)
- Applications: Firmware/boot memory, code storage, data logging in embedded systems
Note: exact voltage ranges and read/QPI speeds may vary by variant; consult the datasheet for precise specs.
Pinout
- Function: Serial NOR flash memory with SPI interface (pins for CS, CLK, MOSI/DI, MISO/DO, WP#, HOLD#, VCC, GND) used to store firmware or data with typical SPI read/write/erase operations.
Manufacturer
Application
- Boot firmware storage for microcontrollers and SoCs
- Execute-In-Place (XIP) code storage in embedded systems
- Firmware updates and recovery
- Data logging and configuration storage in industrial and consumer electronics
- Networking equipment (routers, switches, modems)
- Industrial automation and control systems
- IoT devices, cameras, wearables, and other consumer electronics
Package
Frequently Asked Questions
Q: What is the memory density and organization of the MX25U8033EBAI-12G?
A: It is an 8Mbit NOR Flash organized as 1M x 8 bits, suitable for code and data storage in low-power applications.
Q: Does this device support Quad SPI for high-speed data transfer?
A: Yes, the memory interface is SPI - Quad I/O, enabling faster read/write operations up to 80 MHz clock frequency.
Q: What is the supply voltage range for this Flash memory?
A: The operating voltage is 1.65V to 2V, ideal for low-voltage and battery-powered designs.
Q: What is the typical write cycle time for a page program?
A: Page program time is typically 3ms, with word program time around 30μs, ensuring efficient data writing.
Q: Is this component suitable for industrial temperature environments?
A: Yes, it operates from -40°C to 85°C, making it reliable for industrial and outdoor applications.
Q: What package options are available for the MX25U8033EBAI-12G?
A: It comes in an 8-ball WLCSP (XFBGA) package, suitable for space-constrained surface mount designs.