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MX35UF2GE4AD-Z4I
+StücklisteIC FLASH 2GBIT SPI/QUAD 8WSON
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HerstellerMakronix
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Herstellerteil #MX35UF2GE4AD-Z4I
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Spezifikationen
| Attribut | Wert |
| Series | MX35UF |
| Part Status | Active |
| Base Product Number | MX35UF2 |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (SLC) |
| Memory Size | 2Gbit |
| Memory Organization | 512M x 4 |
| Memory Interface | SPI - Quad I/O |
| Clock Frequency | 133 MHz |
| Voltage - Supply | 1.7V ~ 1.95V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 8-WDFN Exposed Pad |
| Supplier Device Package | 8-WSON (8x6) |
| Packaging | Tray |
Übersicht
Description
Key features include fast data transfer rates, low power consumption, and support for advanced error correction codes (ECC) to ensure data integrity. The MX35UF2GE4AD-Z4I is commonly used in consumer electronics, industrial automation systems, automotive applications, and other sectors requiring efficient and reliable non-volatile storage solutions. It supports standard interfaces that facilitate integration with various microcontrollers and processors, providing flexibility in system design. Overall, this NAND flash memory is a versatile component for the evolving needs of digital storage applications.
Equivalent
Features
Key features include:
- High-speed data transfer capabilities.
- Endurance and reliability due to SLC technology.
- Low power consumption, ideal for battery-operated devices.
- A wide operating temperature range, suitable for industrial applications.
- Advanced error correction and wear leveling to enhance data integrity and lifespan.
This chip is commonly used in applications that require robust and reliable storage solutions, such as embedded systems, industrial controls, and consumer electronics.
Pinout
The primary function of the MX35UF2GE4AD-Z4I is to provide non-volatile storage, meaning it retains data even without power. It is often used in various applications, such as embedded systems, consumer electronics, and industrial devices. Its NAND Flash technology allows for high-density storage, making it suitable for storing large amounts of data in a compact form factor.
The pins on the device are used for various functions, including power supply, ground, data input/output, and control signals necessary for reading, writing, and erasing data. Specific pin configurations and functions should be referenced in the manufacturer's datasheet for exact details, as they provide comprehensive information necessary for integrating the chip into a system.
Manufacturer
Application
1. Embedded Systems: Used in microcontrollers and processors for data storage.
2. Consumer Electronics: Found in smartphones, tablets, and digital cameras for storing media and applications.
3. Industrial Applications: Utilized in machinery requiring robust, reliable storage solutions.
4. Automotive: Employed in infotainment systems and navigation units.
5. Networking Equipment: Used in routers and switches for firmware and data storage.
6. Smart Devices: Integrated into IoT devices for data storage and retrieval tasks.
These applications leverage the chip’s high-capacity storage and durability.
Package
Frequently Asked Questions
Q: What is the memory density and organization of the MX35UF2GE4AD-Z4I?
A: It is a 2Gbit NAND Flash device organized as 512M x 4 bits, suitable for code and data storage in embedded systems.
Q: What is the operating voltage range for this component?
A: It operates at a low voltage of 1.7V to 1.95V, ideal for power-sensitive and battery-powered applications.
Q: Does this memory support high-speed data transfer?
A: Yes, it features a Quad I/O SPI interface with a clock frequency up to 133 MHz, enabling fast read and write operations.
Q: What is the temperature range for reliable operation?
A: It supports an industrial temperature range from -40°C to +85°C, ensuring stable performance in harsh environments.
Q: Is this part a non-volatile memory type?
A: Yes, it is non-volatile FLASH technology using SLC (Single-Level Cell) NAND, providing high endurance and data retention.
Q: What package is available for surface mount assembly?
A: It comes in an 8-WDFN exposed pad package (8-WSON 8x6mm), optimized for efficient thermal dissipation and compact PCB design.
Q: Can this device be used in automotive or industrial control systems?
A: Given its -40°C to 85°C range and SPI interface, it is suitable for industrial automation, IoT, and networking equipment.
