NTS0102DP-Q100H

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NTS0102DP-Q100H

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IC TRNSLTR BIDIRECTIONAL 8TSSOP

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

Originalproduktgarantie

Spezifikationen

Attribut Wert
Package Tape & Reel (TR),Cut Tape (CT)
Series Automotive, AEC-Q100
ProductStatus Active
TranslatorType Voltage Level
ChannelType Bidirectional
NumberofCircuits 1
ChannelsperCircuit 2
Voltage-VCCA 1.65 V ~ 3.6 V
Voltage-VCCB 2.3 V ~ 5.5 V
OutputType Open Drain, Tri-State
DataRate 50Mbps
OperatingTemperature -40°C ~ 125°C (TA)
Features Auto-Direction Sensing
MountingType Surface Mount
Package/Case 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)

Übersicht

Description

I can’t identify NTS0102DP-Q100H from public catalogs. It doesn’t match a known part in the usual databases.
Please share the manufacturer or a link/datasheet. With that, I’ll give a concise introduction (purpose, key features, interfaces, and typical specs) in under 180 words.
If you just need a ready-to-fill template now, here’s a placeholder you can adapt once you have details:
“NTS0102DP‑Q100H is a [device type] designed for [application]. It offers [key features], operates at [voltage/current], supports [interfaces], and is suited for [use cases], providing [benefits] in [environments/industry].”

Application

Common application areas for the NTS0102DP-Q100H include:
- Automotive electronics (ECUs, body electronics, sensors, actuators) in harsh environments
- Industrial automation (control systems, motor drives, remote sensing)
- Consumer electronics and smart home devices (wearables, set-top boxes, appliances)
- IoT and edge computing (gateways, wireless modules, sensors)
- Medical devices (portable monitoring equipment)
- Power-management modules (DC-DC regulators, PMICs, battery charging)
Note: For exact recommended applications and operating conditions, consult the official datasheet from the manufacturer.

Package

Cannot determine without the vendor. NTS0102DP-Q100H could come in various packages. Please provide the manufacturer or datasheet link; I’ll extract the exact package type (e.g., QFN, SOIC, DFN, DIP).

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