OXPCIE954-FBAG

The OXPCIE954-FBAG is a high-performance PCI Express bridge chip designed to facilitate communication between PCI Express and legacy PCI devices. It serves as an essential component in systems requiring the integration of newer PCIe technology with older PCI-based components. The OXPCIE954-FBAG offers multiple downstream PCI interfaces, allowing for the expansion of PCI slots in a system that primarily supports PCIe. This capability is particularly beneficial in applications where maintaining compatibility with existing PCI cards is crucial.
Key features of the OXPCIE954-FBAG include high data throughput, low latency, and robust error handling to ensure reliable data transmission. It is engineered to support a range of operating systems and comes with drivers and software tools to simplify integration into various system architectures. The device is typically used in industrial computing, telecommunications, and network infrastructure where bridging different generations of PCI technology is necessary. Its compact FBGA (Fine-Pitch Ball Grid Array) packaging allows for efficient use of board space, making it suitable for compact or space-constrained designs.

The OXPCIE954-FBAG is a PCI Express (PCIe) to UART bridge controller, offering advanced features for serial communication. Key features include:
1. High-Speed UARTs: Supports up to four UART channels with data rates up to 15 Mbps, ideal for high-speed serial communication.
2. PCIe Interface: Provides a single-lane PCI Express interface ensuring high data throughput and compatibility with modern systems.
3. Flexible UART Configuration: Programmable baud rate generator and support for 5, 6, 7, 8-bit data formats with parity and stop bit adjustments.
4. Advanced FIFO Buffers: Includes deep FIFO buffers to minimize CPU overhead and optimize data flow without loss.
5. Flow Control: Hardware and software flow control options for reliable data transmission.
6. Low Power Consumption: Designed with low power requirements, suitable for energy-efficient applications.
7. Operating System Support: Compatible with various operating systems, ensuring wide usability in different environments.
8. Compact Package: Available in a 100-pin FBGA (Fine-Pitch Ball Grid Array) package for space-constrained applications.
These features make the OXPCIE954-FBAG a versatile choice for integrating UART capabilities into PCIe-based systems.

The OXPCIE954-FBAG is a PCIe bridge chip designed for use in high-performance communication applications. It typically features a 160-pin count and serves as a PCIe-to-PCI bridge. The chip's primary function is to facilitate the connection between a PCI Express (PCIe) interface and multiple PCI interfaces. This allows for legacy PCI devices to be connected to modern systems that primarily support PCIe, ensuring compatibility and extending the usability of older hardware components.
The bridge facilitates seamless data transfer between the different bus architectures, supporting a wide range of applications where high-speed data throughput and compatibility are necessary. The OXPCIE954-FBAG is often used in networking, storage, and industrial computing solutions to bridge the gap between older PCI-based hardware and newer systems supporting PCIe.

The OXPCIE954-FBAG is manufactured by Oxford Semiconductor. Oxford Semiconductor, now part of PLX Technology, was known for designing and producing high-performance silicon and software solutions for the connectivity and storage markets. The company specialized in creating products that facilitate communication between various computing and electronic devices, particularly focusing on bridging technologies and connectivity solutions. Their products were often used in applications requiring robust data transfer and peripheral connectivity, such as PCI Express bridges and UART controllers.

The OXPCIE954-FBAG is typically used in applications requiring high-speed data transfer and efficient connectivity solutions. Its main application areas include:
1. Networking: Facilitating communication between network devices.
2. Data Centers: Enhancing server connectivity and data throughput.
3. Industrial Automation: Supporting machine-to-machine communication and data acquisition systems.
4. Telecommunications: Improving infrastructure for voice and data transmission.
5. Consumer Electronics: Enabling high-performance peripherals and multimedia devices.
6. Embedded Systems: Providing reliable interfacing solutions in custom hardware designs.
These applications benefit from the component's ability to handle complex data processing tasks efficiently.

The OXPCIE954-FBAG is a type of semiconductor package known as a Fine-Pitch Ball Grid Array (FBGA). This package features a grid of solder balls on the underside, allowing for high-density connections to a printed circuit board, suitable for applications requiring compact, reliable, and efficient integration.