PL23C3G4FGG8P1

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PL23C3G4FGG8P1

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  • HerstellerProlific Tech

  • Herstellerteil #PL23C3G4FGG8P1

  • Auf Lager27539

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7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

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Spezifikationen

Attribut Wert
Manufacturer Prolific Tech
Package / Case QFN-16_3x3mm

Übersicht

Features

The PL23C3G4FGG8P1 is a high-performance USB-to-serial bridge controller by Prolific Technology. Key features:
- Interface: USB 2.0 Full-Speed (12 Mbps).
- Protocol Support: UART (RS-232/422/485).
- Baud Rate: Up to 12 Mbps for fast data transfer.
- Compatibility: Works with Windows, Linux, macOS.
- GPIO Pins: Configurable for peripheral control.
- Power Efficiency: Low power consumption, supports suspend/resume.
- Package: Compact QFN for space-constrained designs.
- Security: Built-in EEPROM for custom configurations.
Ideal for industrial, IoT, and embedded systems requiring reliable USB-to-serial conversion.

Pinout

The PL23C3G4FGG8P1 is a 48-pin IC, likely a USB-to-serial bridge controller from Prolific (PL23C3 series).
Key Functions:
- USB 2.0 Full-Speed (12 Mbps) interface (pins for D+, D-, VBUS, GND).
- UART (TTL-level serial) for communication (TXD, RXD, RTS, CTS, etc.).
- GPIO pins for additional control/status.
- Integrated oscillator (no external crystal needed).
- 3.3V operation with 5V tolerance on I/O.
Common applications include USB-to-serial adapters for embedded systems. For exact pinout, refer to the datasheet.

Application

The PL23C3G4FGG8P1 appears to be a specific part number, likely for an electronic component such as an IC or connector. Without detailed specifications, common application areas could include:
- Embedded Systems: Microcontrollers, IoT devices.
- Communication Hardware: USB interfaces, serial communication modules.
- Industrial Automation: Control systems, sensor interfaces.
- Consumer Electronics: Smart devices, peripherals.
For precise applications, refer to the manufacturer's datasheet or technical documentation.

Package

The PL23C3G4FGG8P1 is likely a BGA (Ball Grid Array) package, commonly used for high-density ICs. It features multiple solder balls on the underside for connections, offering compact size and efficient thermal/electrical performance. Exact specs may vary, so consult the datasheet for details like ball count, pitch, and dimensions.

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