Abbildungen dienen nur als Referenz
PTMA210452M V1
+StücklisteIC RF AMP 1.9GHZ-2.2GHZ DSO20-63
-
HerstellerInfineon-Technologien
-
Herstellerteil #PTMA210452M V1
-
Datenblatt PTMA210452M V1 DataSheet
-
Paket SOIC-20
-
Auf Lager8449
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Supplier | Infineon Technologies |
| Package | Tape & Reel (TR) |
| ProductStatus | Obsolete |
| Frequency | 1.9GHz ~ 2.2GHz |
| Gain | 28dB |
| MountingType | Surface Mount |
| Package/Case | 20-SOIC (0.433, 11.00mm Width) Exposed Pad |
Übersicht
Description
PTMA210452M V1 could be a code designation for a course or a technical document. Typically, "PTMA" might stand for a subject area or department, such as Project Management or Technical Management. The numbers could indicate a course level or version, with "210452" perhaps signifying a specific course or module number, and "M V1" possibly meaning "Module Version 1."
The introduction to this course or document would outline its objectives, scope, and relevance. It might cover the fundamental principles, methodologies, or skills that participants or readers are expected to learn. Additionally, it would likely include details about the target audience, prerequisites, and how the content applies to real-world scenarios or professional development. For precise details, reviewing the specific syllabus or document is recommended.
Equivalent
Features
1. Frequency Range: It is designed to operate efficiently within specific frequency bands, often used in telecommunications.
2. High Efficiency: Offers excellent RF performance with high efficiency, making it suitable for power-sensitive applications.
3. Power Output: Capable of delivering significant power output, often in the range of watts, depending on the specific application needs.
4. Gain: Provides a substantial gain which is crucial for amplifying weak signals in RF applications.
5. Compact Package: Usually comes in a compact and thermally efficient package, helping with space-constrained designs.
6. Thermal Management: Designed to handle high temperatures and dissipate heat effectively, ensuring reliable operation.
7. Robust Construction: Built to withstand tough environmental conditions, valuable for industrial and commercial applications.
8. Compatibility: Often designed to be compatible with various circuit architectures, enabling flexibility in design.
Please refer to specific datasheets or technical documentation for detailed specifications and application guidelines.