RS70B32G4S15G

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RS70B32G4S15G

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Spezifikationen

Attribut Wert
Manufacturer Rayson
Package / Case TFBGA-153(11.5x13)
Memory Size 32GB
Operating Temperature -25℃~+85℃
Voltage - Supply 2.7V~3.6V
Interface eMMC 5.1
Sequential Read / Write (MB / s) 310/190 MB/s

Übersicht

Equivalent

The RS70B32G4S15G is a 32Gb DDR4 SDRAM chip. Equivalent products include:
- Samsung K4A8G165WB-BCRC (8Gb, similar density when combined)
- Micron MT40A2G8SA-075:E (16Gb, similar density when combined)
- SK Hynix H5AN8G6NAFR-UHC (8Gb, similar density when combined)
For exact replacements, check datasheets for matching specs (speed, voltage, density).

Features

The RS70B32G4S15G is a high-performance DDR4 memory module with the following key features:
- Capacity: 32GB
- Type: DDR4 SDRAM
- Speed: 3200MHz (PC4-25600)
- Latency: CL22 (22-22-22 timings)
- Voltage: 1.2V (low power consumption)
- Form Factor: 288-pin DIMM
- Error Correction: Non-ECC (unbuffered)
- Compatibility: Supports Intel/AMD platforms
- Reliability: High-quality ICs with stable performance
Ideal for desktops, workstations, and servers requiring fast, efficient memory.

Pinout

The RS70B32G4S15G is a 32GB DDR4 SDRAM module (likely a RDIMM or LRDIMM).
- Pin Count: 288-pin (standard for DDR4 modules).
- Function: Provides high-speed, volatile memory storage for servers and workstations, supporting data transfer rates up to 3200 MT/s (depending on configuration).
Key features:
- Capacity: 32GB.
- Voltage: 1.2V (DDR4 standard).
- Error Correction: Supports ECC for reliability.
Exact specs may vary by manufacturer—check datasheets for details.

Package

The RS70B32G4S15G is a BGA (Ball Grid Array) package. It features a compact, surface-mount design with solder balls arranged in a grid pattern, ideal for high-density and high-performance applications. The specific dimensions and ball count depend on the manufacturer's datasheet. BGA packages offer excellent thermal and electrical performance, commonly used in memory and IC modules.

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