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S29GL256S10TFI010
+StücklisteIC FLASH 256MBIT PARALLEL 56TSOP
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HerstellerCypress Semiconductor Corp.
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Herstellerteil #S29GL256S10TFI010
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Paket TSOP-56
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Auf Lager1551
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tube |
| Series | GL-S |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 256Mb (16M x 16) |
| Memory Interface | Parallel |
| Write Cycle Time - Word Page | 60ns |
| Access Time | 100 ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
Übersicht
Description
The TFI indicates a specific package type and temperature range, with TFI often referring to a thin small outline package (TSOP) and an industrial-grade temperature range (-40°C to +85°C). The device includes advanced security features and sector protection, allowing for selective erase and write operations, which enhance its reliability and flexibility in data management. Its high-speed performance and endurance make it ideal for applications in automotive, industrial, and consumer electronics that require fast boot times and long data retention.
Equivalent
Features
1. Density: 256 Mbit (32 MB).
2. Architecture: Versatile I/O with support for x8 and x16 data bus widths.
3. Speed: 100 ns access time for fast data retrieval.
4. Interface: Asynchronous read and write operations.
5. Sector Architecture: Uniform 64 KB sectors, allowing for flexible memory management.
6. Endurance: 100,000 program/erase cycles per sector.
7. Data Retention: 20 years, ensuring long-term reliability.
8. Voltage Range: Operates between 2.7V to 3.6V.
9. Temperature Range: Industrial temperature range from -40°C to +85°C.
10. Security Features: Includes hardware and software protection features.
11. Package: Available in TSOP and BGA packages for different application needs.
These features make it suitable for embedded systems, automotive, and industrial applications requiring reliable, non-volatile memory storage.
Pinout
1. Address Pins (A0-A23): Used to specify the memory location for read/write operations.
2. Data Pins (DQ0-DQ15): These are the data input/output pins for a 16-bit wide data bus.
3. Chip Enable (CE#): Activates the chip for operation.
4. Output Enable (OE#): Controls the output buffer to access data from the memory.
5. Write Enable (WE#): Allows write operations to the memory.
6. Reset (RESET#): Resets the device to the read mode.
7. Byte/Word Mode (BYTE#): Selects between 8-bit and 16-bit data mode.
8. Write Protect (WP#): Protects the memory from writing.
9. Ready/Busy (RY/BY#): Indicates the status of the device (whether it is busy or ready for the next operation).
10. VCC and VSS: Power supply and ground pins.
This device is typically used in applications requiring reliable non-volatile memory, such as embedded systems and consumer electronics.
Manufacturer
Application
1. Embedded Systems: Used in microcontrollers for firmware storage.
2. Consumer Electronics: Utilized in devices like digital cameras and MP3 players for code storage.
3. Automotive Industry: Employed for infotainment systems and engine control units.
4. Networking Equipment: Provides firmware storage in routers and switches.
5. Industrial Controls: Used in PLCs and other control systems for program storage.
6. Medical Devices: Stores operating software in diagnostic equipment.
7. Telecommunications: Used in base stations for software and data storage.
Its reliability, fast read speeds, and endurance make it suitable for these applications.