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S29GL512T10TFI010
+StücklisteIC FLASH 512MBIT PARALLEL 56TSOP
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HerstellerCypress Semiconductor Corp.
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Herstellerteil #S29GL512T10TFI010
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Datenblatt S29GL512T10TFI010 DataSheet
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Paket TFSOP-56
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Auf Lager3924
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | GL-T |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 512Mb (64M x 8) |
| Memory Interface | Parallel |
| Write Cycle Time - Word Page | 60ns |
| Access Time | 100 ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
Übersicht
Description
Key features include a 3V power supply for low power consumption, a parallel interface for easy integration into existing systems, and a typical access time of around 100 ns, making it suitable for quick data retrieval. The S29GL512T10TFI010 also supports advanced security features such as sector protection and hardware reset for enhanced data integrity and protection against unauthorized access. Its operating temperature range is from -40°C to 85°C, making it suitable for a wide range of environments. Overall, this flash memory device provides a robust solution for applications requiring reliable data storage and quick access.
Equivalent
Features
This NOR Flash memory offers fast programming capabilities with page programming, and its sector erase time is efficient for bulk data management. It includes security features like a hardware reset pin and sector-level protection, which prevent unintended data alteration. Its endurance is rated for 100,000 program/erase cycles per sector, and it retains data for up to 20 years.
The S29GL512T10TFI010 operates within the industrial temperature range of -40°C to 85°C, making it suitable for various applications in harsh environments. Its TSOP package is space-efficient, aiding in compact product design.
Pinout
Key functions of this memory device include:
1. Read/Write Operations: Supports standard operations for reading and programming data.
2. Sector Erase: Allows erasure of data in specified sectors.
3. Block Locking: Provides features for locking specific blocks to prevent accidental overwrites.
4. Status Register: Indicates operational status and errors.
5. Protection Features: Includes hardware and software methods for protecting data integrity.
6. High-Performance: Offers fast read access times and low power consumption.
These functions make it suitable for applications needing reliable, fast, and non-volatile data storage, such as embedded systems and automotive components. For precise pin count and detailed pin functions, referring to the specific datasheet is recommended.
Manufacturer
Application
1. Embedded Systems: Used in microcontrollers and industrial equipment for firmware storage.
2. Automotive: Supports navigation systems, infotainment, and engine control units (ECUs) due to its robustness.
3. Telecommunications: Used in network routers and switches for boot code and configuration data.
4. Consumer Electronics: Found in devices like digital cameras and gaming consoles for storing system software.
5. Medical Devices: Utilized in medical equipment where data integrity and quick access are critical.
6. Aerospace and Defense: Used in avionics and military systems for secure data storage.
These applications benefit from the chip's ability to retain data without power and its fast retrieval speed.