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S34ML01G200BHI000
+StücklisteIC FLASH 1GBIT PARALLEL 63BGA
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HerstellerCypress Semiconductor Corp.
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Herstellerteil #S34ML01G200BHI000
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Paket VFBGA-63
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Auf Lager1511
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
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Spezifikationen
| Attribut | Wert |
| Package / Case | Tray |
| Series | ML-2 |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 1Gb (128M x 8) |
| Memory Interface | Parallel |
| Write Cycle Time - Word Page | 25ns |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
Übersicht
Description
The device operates on a 3.3V power supply and supports standard NAND interface protocols. It includes features like wear leveling, error correction code (ECC), and bad block management to enhance data integrity and longevity. The S34ML01G200BHI000 is available in a 48-pin TSOP (Thin Small Outline Package) format, making it suitable for compact designs. It is often chosen for applications that demand high performance and data retention reliability, such as automotive systems and critical infrastructure, due to its robust design and endurance characteristics.
Equivalent
Features
1. Capacity: 1 Gigabit (Gb) of storage.
2. Architecture: Single-level cell (SLC) NAND, which offers high reliability and endurance.
3. Page Size: Typically 2048 bytes, with an additional 64 bytes for error correction and metadata.
4. Block Size: Composed of 64 pages, offering efficient erase operations.
5. Interface: Supports asynchronous NAND interface for compatibility with a range of controllers.
6. Performance: Designed for fast read and write operations, optimizing data throughput.
7. Endurance: Higher program/erase cycles compared to multi-level cells, ideal for applications requiring frequent updates.
8. Reliability: Built-in error correction code (ECC) support to ensure data integrity.
9. Voltage Range: Operates typically at 3.3V, suitable for various embedded applications.
10. Temperature Range: Industrial grade, supporting a wide temperature range for robust performance in different environments.
These features make it suitable for use in consumer electronics, industrial devices, and embedded systems where durability and reliability are crucial.
Pinout
- Pin Count: The S34ML01G200BHI000 package is commonly available in a 48-pin TSOP package.
- Functions:
- I/O Pins (I/O0-I/O7): Data input/output pins used for transferring data to and from the memory.
- CLE (Command Latch Enable): Used to input command codes.
- ALE (Address Latch Enable): Used to latch address information.
- CE# (Chip Enable): Activates the device.
- RE# (Read Enable): Controls the data output.
- WE# (Write Enable): Controls the data input.
- WP# (Write Protect): Protects the memory from being written to.
- R/B# (Ready/Busy): Indicates device status.
- VCC: Power supply pin.
- VSS: Ground pin.
This configuration allows the device to perform standard NAND Flash operations like read, program, and erase. Always refer to the manufacturer’s datasheet for specific and detailed information.
Manufacturer
Application
1. Consumer Electronics: Devices like smartphones, tablets, and digital cameras utilize this chip for data storage.
2. Industrial Systems: Used in industrial control systems and automation equipment for reliable data retention.
3. Automotive: Employed in infotainment systems and advanced driver-assistance systems (ADAS) for data storage needs.
4. Networking: Utilized in routers, switches, and networking equipment for firmware and configuration storage.
5. Computing: Integrated into laptops and desktops for SSDs and other storage solutions.
These application areas benefit from its high-density storage capacity and reliability.