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S34ML04G100BHI000
+StücklisteIC FLASH 4GBIT PARALLEL 63BGA
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HerstellerSpannweite
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Herstellerteil #S34ML04G100BHI000
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Datenblatt S34ML04G100BHI000 DataSheet
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Paket BGA-63
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Auf Lager2404
365 Tage Qualitätsgarantie
7*24 Stunden-Servicegarantie
90-Tage Kundendienstgarantie
Originalproduktgarantie
Spezifikationen
| Attribut | Wert |
| Package | Bulk |
| Series | ML-1 |
| ProductStatus | Active |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND |
| MemorySize | 4Gb (512M x 8) |
| MemoryInterface | Parallel |
| WriteCycleTime-WordPage | 25ns |
| Voltage-Supply | 2.7V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 63-VFBGA |
Übersicht
Description
Key features of the S34ML04G100BHI000 include:
1. Capacity: A density of 4 gigabits, offering ample storage for various applications.
2. Interface: It uses an asynchronous interface that is compatible with standard NAND flash protocols, facilitating easy integration with existing systems.
3. Performance: Provides reliable performance with a fast read and write speed, making it suitable for applications that require efficient data processing.
4. Durability: High endurance and data retention capabilities, ensuring long-term reliability and minimal data corruption over time.
5. Package: It comes in a standard TSOP (Thin Small Outline Package), which aids in space-saving on PCBs (Printed Circuit Boards).
This NAND flash memory is typically utilized in applications requiring high-capacity storage with efficient and reliable data access and manipulation.
Equivalent
Features
The chip supports a wide range of applications, including embedded systems, consumer electronics, and industrial applications. It has a standard NAND interface and offers a high endurance of up to 100,000 program/erase cycles, making it suitable for applications requiring frequent data rewriting. The chip is housed in a TSOP (Thin Small Outline Package) for easy integration into various system designs. Additionally, it includes features like error correction code (ECC) support to enhance data integrity and reliability.
Pinout
Typically, the 48-pin TSOP configuration includes the following key pins:
1. Data Input/Output (I/O pins): Used for data transfer between the device and the controller.
2. CLE (Command Latch Enable): Latches command cycles.
3. ALE (Address Latch Enable): Latches address cycles.
4. CE# (Chip Enable): Activates the device.
5. RE# (Read Enable): Controls data output during read operations.
6. WE# (Write Enable): Controls data input during write operations.
7. WP# (Write Protect): Provides hardware protection against unwanted programming or erasure.
8. R/B# (Ready/Busy): Indicates the status of the operation.
9. VCC: Power supply.
10. VSS: Ground.
For precise pin details and functions, refer to the manufacturer's datasheet, which provides comprehensive information about signal descriptions and pin configurations.
Manufacturer
Application
1. Consumer Electronics: Devices like smartphones, tablets, and digital cameras.
2. Industrial Systems: Embedded systems for machinery, robotics, and control systems.
3. Automotive Electronics: Infotainment systems, navigation devices, and data logging.
4. Networking Equipment: Routers, switches, and network-attached storage.
5. Computing Devices: Laptops, SSDs, and hybrid drives.
Its high-density storage, endurance, and reliability make it suitable for any application needing non-volatile memory solutions.