S912XEP100BMAGR

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S912XEP100BMAGR

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IC MCU 16BIT 1MB FLASH 144LQFP

  • HerstellerNXP USA Inc.

  • Herstellerteil #S912XEP100BMAGR

  • Paket LQFP-144

  • Auf Lager4572

365 Tage Qualitätsgarantie

7*24 Stunden-Servicegarantie

90-Tage Kundendienstgarantie

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Spezifikationen

Attribut Wert
Supplier NXP USA Inc.
Package Tape & Reel (TR)
Series HCS12X
ProductStatus Active
CoreProcessor HCS12X
CoreSize 16-Bit
Speed 50MHz
Connectivity CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals LVD, POR, PWM, WDT
NumberofI/O 119
ProgramMemorySize 1MB (1M x 8)
ProgramMemoryType FLASH
EEPROMSize 4K x 8
RAMSize 64K x 8
Voltage-Supply(Vcc/Vdd) 1.72V ~ 5.5V
DataConverters A/D 24x12b
OscillatorType External
OperatingTemperature -40°C ~ 125°C (TA)
MountingType Surface Mount
Package/Case 144-LQFP

Übersicht

Description

S912XEP100BMAGR appears to be a semiconductor device part number. Without the manufacturer and datasheet, its exact type and features can’t be confirmed. A precise intro would typically state the device’s function (e.g., microcontroller, driver, PMIC), core features, and its common applications, followed by key specs (voltage range, I/O, peripherals) and packaging.
To craft a concise, under-180-word intro, please provide:
- Manufacturer or a datasheet link
- The device category (MCU, power-management IC, driver, sensor, etc.)
If you share the vendor/datasheet, I’ll generate a precise, verified synopsis promptly.

Pinout

Pin count: 100 pins.
Function: 16-bit microcontroller (MC9S12XEP100, HCS12X family) with on-chip flash RAM and embedded peripherals for automotive/embedded control.

Package

Package type: 100-ball Ball Grid Array (BGA).

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