SCT2330TVBR

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SCT2330TVBR

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Spezifikationen

Attribut Wert
Manufacturer SCT
Package / Case TSOT-23-6L
Voltage - Supply 3.8V~32V
Function Step-down type
Synchronous Rectifier Yes
Number of Outputs 1
Topology Step-Down
Operating Temperature -40℃~+125℃
Current - Quiescent (Iq) 20uA
Switch tube (built - in / external) Built-in
Current - Output 3A
Frequency - Switching 360kHz~440kHz

Übersicht

Description

The SCT2330TVBR is a high-performance N-channel MOSFET from STMicroelectronics, designed for power management applications. Key features include:
- Voltage Rating: 30V
- Current Handling: Up to 100A (pulsed)
- Low On-Resistance (RDS(on)): 2.3mΩ (typical) at 10V VGS
- Fast Switching: Optimized for efficiency in DC-DC converters, motor control, and load switches
- Package: PowerFLAT 5x6 for compact PCB design
Ideal for automotive, industrial, and consumer electronics, it offers robust thermal performance and reliability.

Equivalent

The SCT2330TVBR (30V, 3A synchronous buck converter) has several equivalents:
- TPS54302 (TI)
- MP2307 (MPS)
- AP63300 (Diodes Inc.)
- LM2675 (TI)
- RT6259B (Richtek)
These offer similar voltage/current specs and synchronous buck topology. Verify pinout and specs for exact replacement.

Application

The SCT2330TVBR is a 3A, 23V synchronous step-down converter with high efficiency and a wide input range (4.5V–23V). Key application areas include:
- Consumer Electronics: Powering smart home devices, routers, and set-top boxes.
- Industrial Systems: Embedded systems, sensors, and automation controls.
- Networking Equipment: Switches, modems, and PoE devices.
- Battery-Powered Devices: Portable gadgets and IoT nodes.
- Automotive Electronics: Infotainment and ADAS subsystems (non-critical).
Its compact size, high efficiency, and robust performance make it ideal for space-constrained, low-power applications.

Package

The SCT2330TVBR is a DFN-8 (3x3) package type. It features a dual flat no-lead design with 8 pins and a compact 3mm x 3mm footprint, suitable for space-constrained applications. This package offers good thermal performance and is commonly used in power management ICs.

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