SI2307CDS-T1-GE3

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SI2307CDS-T1-GE3

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MOSFET P-CH 30V 3.5A SOT23-3

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Spezifikationen

Attribut Wert
Package Tape & Reel (TR),Cut Tape (CT)
Series TrenchFET®
ProductStatus Active
FETType P-Channel
Technology MOSFET (Metal Oxide)
DraintoSourceVoltage(Vdss) 30 V
Current-ContinuousDrain(Id)@25°C 3.5A (Tc)
DriveVoltage(MaxRdsOnMinRdsOn) 4.5V, 10V
RdsOn(Max)@IdVgs 88mOhm @ 3.5A, 10V
Vgs(th)(Max)@Id 3V @ 250µA
GateCharge(Qg)(Max)@Vgs 6.2 nC @ 4.5 V
Vgs(Max) ±20V
InputCapacitance(Ciss)(Max)@Vds 340 pF @ 15 V
PowerDissipation(Max) 1.1W (Ta), 1.8W (Tc)
OperatingTemperature -55°C ~ 150°C (TJ)
MountingType Surface Mount
SupplierDevicePackage SOT-23-3 (TO-236)

Übersicht

Description

The SI2307CDS-T1-GE3 is a P-channel MOSFET from Vishay Siliconix, designed for low-voltage, high-efficiency applications. Key features include:
- Voltage Rating: -20V (Drain-Source).
- Current Rating: -4.3A (Continuous Drain).
- Low On-Resistance: 45mΩ (max at VGS = -4.5V).
- Gate Threshold: -1V (typical), enabling compatibility with 3.3V/5V logic.
- Compact Package: SOT-23, ideal for space-constrained designs.
Common uses include power management, load switching, and battery protection in portable devices, DC-DC converters, and motor control circuits. Its low gate charge and fast switching enhance efficiency in high-frequency applications.
For detailed specs, refer to the datasheet.

Equivalent

Equivalent products to the SI2307CDS-T1-GE3 (P-channel MOSFET, 20V, 3.7A) include:
- AO3401A (Vishay)
- DMG2305UX (Diodes Inc.)
- FDC6333C (Fairchild/ON Semi)
- IRLML6402 (Infineon)
These alternatives offer similar specs (P-channel, ~20V, 2-4A). Verify pinout and parameters for compatibility.

Features

The SI2307CDS-T1-GE3 is a P-channel MOSFET with the following key features:
- Voltage Rating: -30V (Drain-to-Source, VDS)
- Current Rating: -5.7A (Continuous Drain Current, ID)
- Low On-Resistance: 40mΩ (max) at VGS = -10V
- Gate Threshold Voltage: -1V to -2.5V (VGS(th))
- Fast Switching: Low gate charge (Qg) for efficient performance
- Package: SOT-23 (Compact surface-mount)
- Applications: Power management, load switching, battery protection
Designed for high efficiency and space-constrained designs.

Pinout

The SI2307CDS-T1-GE3 is a P-channel MOSFET in a SOT-23-3 package with 3 pins.
Pin Functions:
1. Gate (G): Controls the MOSFET's switching.
2. Source (S): Connected to the input voltage (for P-channel).
3. Drain (D): Output connection to the load.
Key Features:
- -20V drain-source voltage (VDS).
- -4.3A continuous drain current (ID).
- Low RDS(on) (e.g., ~50mΩ at VGS = -4.5V).
Commonly used for power switching, load control, and DC-DC conversion.

Manufacturer

The SI2307CDS-T1-GE3 is manufactured by Vishay Intertechnology, a global leader in semiconductors and passive electronic components.
Vishay is a publicly traded company (NYSE: VSH) known for producing a wide range of products, including MOSFETs, diodes, resistors, and capacitors. Founded in 1962, it serves industries like automotive, industrial, computing, and consumer electronics with high-performance components.
The SI2307CDS-T1-GE3 is a P-channel MOSFET, commonly used in power management applications. Vishay is recognized for its reliable, efficient semiconductor solutions.

Application

The SI2307CDS-T1-GE3 is a P-channel MOSFET commonly used in:
1. Power Management – Voltage regulation, load switching in portable devices.
2. Battery Protection – Reverse polarity and overcurrent protection.
3. DC-DC Converters – Efficient power conversion in compact designs.
4. Consumer Electronics – Smartphones, tablets, and wearables for power control.
5. Automotive Systems – Low-voltage applications like infotainment and lighting.
Its small SOT-23 package and low on-resistance make it ideal for space-constrained, energy-efficient designs.

Package

The SI2307CDS-T1-GE3 is a MOSFET in a SOT-23-3 package. This small, surface-mount package is widely used for low-power applications, featuring three pins for compact PCB designs. It's suitable for switching and amplification in portable electronics due to its minimal footprint and efficient thermal performance.

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