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SI9945BDY-T1-GE3
+StücklisteMOSFET 2N-CH 60V 5.3A 8-SOIC
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HerstellerVishay Siliconix
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Herstellerteil #SI9945BDY-T1-GE3
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Datenblatt SI9945BDY-T1-GE3 DataSheet
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Paket SOIC-8
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Auf Lager4981
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Spezifikationen
| Attribut | Wert |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Series | TrenchFET® |
| ProductStatus | Active |
| FETType | 2 N-Channel (Dual) |
| FETFeature | Logic Level Gate |
| DraintoSourceVoltage(Vdss) | 60V |
| Current-ContinuousDrain(Id)@25°C | 5.3A |
| RdsOn(Max)@IdVgs | 58mOhm @ 4.3A, 10V |
| Vgs(th)(Max)@Id | 3V @ 250µA |
| GateCharge(Qg)(Max)@Vgs | 20nC @ 10V |
| InputCapacitance(Ciss)(Max)@Vds | 665pF @ 15V |
| Power-Max | 3.1W |
| OperatingTemperature | -55°C ~ 150°C (TJ) |
| MountingType | Surface Mount |
| Package/Case | 8-SOIC (0.154, 3.90mm Width) |
Übersicht
Description
Key specifications include a drain-source voltage (V_DS) of 30V and a continuous drain current (I_D) of around 8A. It is housed in a compact SO-8 package, which is suitable for surface-mount technology (SMT), making it ideal for space-constrained applications.
The device also offers enhanced thermal performance and reliability, thanks to its design and construction. This makes it a popular choice for engineers looking to optimize performance and energy efficiency in their designs. Additionally, the SI9945BDY-T1-GE3 is RoHS-compliant, indicating it meets environmental and safety standards by limiting the use of hazardous substances.
Equivalent
1. FDS8949 - by ON Semiconductor.
2. IRF7313 - by Infineon Technologies.
3. FDD8447L - by ON Semiconductor.
4. NDS9945 - by Fairchild Semiconductor.
Ensure to verify parameters like voltage, current ratings, and package compatibility when selecting an equivalent.
Features
1. Dual N-Channel Configuration: Provides flexibility and efficiency in circuit design.
2. Low On-Resistance: About 0.045 ohms at 4.5V, enabling efficient current conduction and minimizing power loss.
3. High Current Capability: Can handle continuous drain current up to 5.8A, suitable for switching operations.
4. Compact Package: Available in an SO-8 package, optimizing space for compact designs.
5. Enhanced Switching Speed: Fast switching performance, ideal for high-speed applications.
6. Low Gate Charge: Reduces the gate drive power requirements, enhancing overall efficiency.
7. Thermal Resistance: Effective thermal management characteristics, allowing better performance under thermal stress.
This MOSFET is suitable for various applications, including DC-DC converters, power management, and load switching, making it versatile and efficient for modern electronic needs.
Pinout
1. Pin 1 (G1): Gate of MOSFET 1
2. Pin 2 (S1): Source of MOSFET 1
3. Pin 3 (S1): Source of MOSFET 1 (internally connected to Pin 2)
4. Pin 4 (G2): Gate of MOSFET 2
5. Pin 5 (S2): Source of MOSFET 2
6. Pin 6 (S2): Source of MOSFET 2 (internally connected to Pin 5)
7. Pin 7 (D2): Drain of MOSFET 2
8. Pin 8 (D1): Drain of MOSFET 1
These MOSFETs are used for applications requiring efficient power management, switching, and amplification. The dual configuration allows for more compact designs where two MOSFETs are needed.